1. General Information

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Relays produced after the specific date code that is indicated on each data sheet are lead-free

now. All our signal and power relays are lead-free. Please refer to Lead-Free Status Info.

(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)

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Lead free solder plating currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward

Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays.

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All signal and power relays also comply with RoHS. Please refer to individual data

sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials above the threshold level

that are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE and DecaBDE).

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It has been verified that using lead-free relays in leaded assembly process will not cause any

problems (compatible).

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“LF” is marked on each outer and inner carton. (No marking on individual relays).

2. Recommended Lead Free Solder Profile

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Recommended solder paste Sn-3.0Ag-0.5Cu.

Solder condition

3. Moisture Sensitivity

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Moisture Sensitivity Level standard is not applicable to electromechanical relays.

4. Tin Whisker

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Dipped SnAgCu solder is known as low risk tin whisker. No considerable whisker length was found by our in

house test.

We highly recommend that you confirm your actual solder conditions

Flow Solder condition:

Pre-heating:

maximum 120˚C

Soldering:

dip within 5 sec. at

260˚C solder bath

Solder by Soldering Iron:

Soldering Iron

Temperature: maximum 360˚C

Duration:

maximum 3 sec.

RoHS Compliance and Lead Free Relay Information

DISC

ONTINUED

(2005)