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BRHL2518T4R7MD Datasheet(PDF) 11 Page - Taiyo Yuden (U.S.A.), Inc |
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BRHL2518T4R7MD Datasheet(HTML) 11 Page - Taiyo Yuden (U.S.A.), Inc |
11 / 12 page ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_BR_prec_e-E02R01 Wound Chip power inductor (BR-series) ■PRECAUTIONS 1. Circuit Design Precautions ◆Operating Ambient The products are premised on the usage for the general equipments like the office supply equipment, the telecommunications systems, the measuring equipment, the household equipment and so on. Please ask to TAIYO YUDEN's sales person in advance, if you need to apply them to the equipments or the systems which might have any influences for the human body, the property, like the traffic systems, the safety equipment, the aerospace systems, the nuclear control systems, the medical equipment and soon. 2. PCB Design Precautions ◆Land pattern design 1. Please refer to a recommended land pattern. Technical considerations ◆Land pattern design Surface Mounting 1. The conditions of the picking and placing should be checked in advance. 2. The products are only for reflow soldering. 3. Considerations for automatic placement Precautions ◆Adjustment of mounting machine 1. Excessive physical impact should not be imposed on the products for picking and placing onto the PC boards. 2. Mounting and soldering conditions should be checked in advance. Technical considerations ◆Adjustment of mounting machine The products might be broken if too much stress is given for the picking and placing. 4. Soldering Precautions ◆Reflow soldering 1. Please apply our recommended soldering conditions on the specification as much as possible. 2. The products are only for reflow soldering. 3. Please do not give any stress to a product until it returns in room temperature after reflow soldering. ◆Lead free soldering 1. Please check the adhesion, the solder temperature, the solderability and the shape of solder filet if the solder that is not in the specification is used. ◆Recommended conditions for using a soldering iron (NR10050 Type) Touch a soldering iron to the land pattern not to the product directly. The temperature of a soldering iron is less than 350degC. The soldering is for 3 seconds or less. Technical considerations ◆Reflow soldering 1. The product might break or might make the tombstoning, if the soldering conditions are too far from our recommended conditions. 5. Cleaning Precautions ◆Cleaning conditions 1. Please don't wash by the ultra-sonic waves. Technical considerations ◆Cleaning conditions 1. Washing by the ultra-sonic waves might break the product. |
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