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1N5626 Datasheet(PDF) 1 Page - General Semiconductor |
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1N5626 Datasheet(HTML) 1 Page - General Semiconductor |
1 / 2 page 4/98 1N5624 THRU 1N5627 GLASS PASSIVATED JUNCTION RECTIFIER Reverse Voltage - 200 to 800 Volts Forward Current - 3.0 Amperes FEATURES ♦ Glass passivated cavity-free junction ♦ High temperature metallurgically bonded constructed ♦ Hermetically sealed package ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ Typical IR less than 0.1µA ♦ 3.0 Ampere operation at TA=70°C with no thermal runaway ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: Solid glass body Terminals: Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.04 ounce, 1.1 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS 1N5624 1N5625 1N5626 1N5627 UNITS *Maximum repetitive peak reverse voltage VRRM 200 400 600 800 Volts Maximum RMS voltage VRMS 140 280 420 560 Volts *Maximum DC blocking voltage VDC 200 400 600 800 Volts *Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=70°C I(AV 3.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 125.0 Amps *Maximum instantaneous forward voltage at 3.0A TA=25°C VF 1.0 Volts TA=70°C 0.95 *Maximum DC reverse current TA=25°C 5.0 at rated DC blocking voltage TA=175°C IR 300.0 200.0 µA *Maximum full load reverse current, full cycle average, 0.375" (9.5mm) lead length at TA=70°C IR(AV) 150.0 100.0 µA Typical junction capacitance (NOTE 1) CJ 40.0 pF Typical thermal resistance (NOTE 2) R ΘJA 20.0 °C/W R ΘJL 10.0 *Operating junction temperature range TJ -65 to +175 °C *Storage temperature range TSTG -65 to +200 °C NOTES: (1) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (2) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length, with both leads attached between heatsinks *JEDEC registered values 0.250 (6.3) 0.170 (4.3) 0.052 (1.32) 0.048 (1.22) DIA. DIA. 1.0 (25.4) MIN MAX. 0.300 (7.6) 1.0 (25.4) MIN CASE STYLE G3 Dimensions in inches and (millimeters) *Brazed-lead assembly is covered by Patent No. 3,930,306 |
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