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TLC3704CPWLE Datasheet(PDF) 8 Page - Texas Instruments |
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TLC3704CPWLE Datasheet(HTML) 8 Page - Texas Instruments |
8 / 37 page TLC3704, TLC3704M QUAD MICROPOWER LinCMOS VOLTAGE COMPARATORS SLCS117C − NOVEMBER 1986 − REVISED NOVEMBER 2009 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PRINCIPLES OF OPERATION LinCMOS process The LinCMOS process is a linear polysilicon-gate CMOS process. Primarily designed for single-supply applications, LinCMOS products facilitate the design of a wide range of high-performance analog functions from operational amplifiers to complex mixed-mode converters. This short guide is intended to answer the most frequently asked questions related to the quality and reliability of LinCMOS products. Direct further questions to the nearest TI field sales office. electrostatic discharge CMOS circuits are prone to gate oxide breakdown when exposed to high voltages even if the exposure is only for very short periods of time. Electrostatic discharge (ESD) is one of the most common causes of damage to CMOS devices. It can occur when a device is handled without proper consideration for environmental electrostatic charges, e.g., during board assembly. If a circuit in which one amplifier from a dual op amp is being used and the unused pins are left open, high voltages tends to develop. If there is no provision for ESD protection, these voltages may eventually punch through the gate oxide and cause the device to fail. To prevent voltage buildup, each pin is protected by internal circuitry. Standard ESD-protection circuits safely shunt the ESD current by providing a mechanism whereby one or more transistors break down at voltages higher than the normal operating voltages but lower than the breakdown voltage of the input gate. This type of protection scheme is limited by leakage currents which flow through the shunting transistors during normal operation after an ESD voltage has occurred. Although these currents are small, on the order of tens of nanoamps, CMOS amplifiers are often specified to draw input currents as low as tens of picoamps. To overcome this limitation, TI design engineers developed the patented ESD-protection circuit shown in Figure 1. This circuit can withstand several successive 2-kV ESD pulses, while reducing or eliminating leakage currents that may be drawn through the input pins. A more detailed discussion of the operation of the TI ESD-protection circuit is presented on the next page. All input and output pins on LinCMOS and Advanced LinCMOS products have associated ESD-protection circuitry that undergoes qualification testing to withstand 2000 V discharged from a 100-pF capacitor through a 1500- Ω resistor (human body model) and 200 V from a 100-pF capacitor with no current-limiting resistor (charged device model). These tests simulate both operator and machine handling of devices during normal test and assembly operations. To Protected Circuit D3 R2 Q2 D2 D1 Q1 Input GND R1 VDD Figure 1. LinCMOS ESD-Protection Schematic |
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