CP3BT23G18NEPNOPB datasheet(10/324 Pages) TI1

Part #	CP3BT23G18NEPNOPB

Description	CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces

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Manufacturer	TI1 [Texas Instruments]

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CP3BT23

SNOSCX3A – JULY 2013 – REVISED JANUARY 2014

www.ti.com

3.22 SERIAL DEBUG INTERFACE

The Serial Debug Interface module (SDI module) provides a JTAG-based serial link to an external

debugger, for example running on a PC. In addition, the SDI module integrates an on-chip debug module,

which allows the user to set up to eight hardware breakpoints on instruction execution and data transfer.

The SDI module can act as a CPU bus master to access all memory mapped resources, such as RAM

and peripherals. Therefore it also allows for fast program code download into the on-chip Flash program

memory using the JTAG interface.

Note: The SDI module may assert Freeze mode to gather information, which may cause periodic

fluctuations in response (bus availability, interrupt latency, etc.). Anomalous behavior often may be traced

to SDI activity.

3.23 DEVELOPMENT SUPPORT

In addition to providing the features needed for the next generation of embedded Bluetooth products, the

CP3BT23 devices are backed up by the software resources designers need for rapid product

development, including an operating system, Bluetooth protocol stack implementation, peripheral drivers,

reference designs, and an integrated development environment. Combined with Texas Instrument’s

LMX5251 Bluetooth radio transceiver, the CP3BT23 devices provide a total Bluetooth system solution.

Texas Instruments offers a complete and industryproven application development environment for

CP3BT23 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active

Emulator, Bluetooth Development Board, Bluetooth Protocol Stack, and Application Software. See your

Texas Instruments sales representative for current information on availability and features of emulation

equipment and evaluation boards.

10

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