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TLV3401 Datasheet(PDF) 3 Page - Texas Instruments |
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TLV3401 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 18 page  TLV1701 TLV1702 TLV1704 www.ti.com SBOS589 – DECEMBER 2013 ELECTRICAL CHARACTERISTICS At TA = +25°C, VS = +2.2 V to +36 V, CL = 15 pF, RPULLUP = 5.1 kΩ, VCM = VS / 2 and VS = VPULLUP, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE TA = 25°C, VS = 2.2 V ±0.5 ±3.5 mV VOS Input Offset voltage TA = 25°C, VS = 36 V ±0.3 ±2.5 mV TA = –40°C to +125°C ±5.5 mV dVOS/dT Input offset voltage drift TA = –40°C to +125°C ±4 ±20 μV/°C 15 100 μV/V PSRR Power-supply rejection ratio TA = –40°C to +125°C 20 μV/V INPUT VOLTAGE RANGE VCM Common-mode voltage range TA = –40°C to +125°C (V–) (V+) V INPUT BIAS CURRENT 5 15 nA IB Input bias current TA = –40°C to +125°C 20 nA IOS Input offset current 0.5 nA CLOAD Capacitive load drive See TYPICAL CHARACTERISTICS OUTPUT IO ≤ 4 mA, input overdrive = 100 mV, 900 mV VS = 36 V VO Voltage output swing from rail IO = 0 mA, input overdrive = 100 mV, 600 mV VS = 36 V ISC Short circuit sink current 20 mA Output leakage current VIN+ > VIN– 70 nA SWITCHING CHARACTERISTICS tPHL Propagation delay time, high-to-low Input overdrive = 100 mV 480 ns tPLH Propagation delay time, low-to-high Input overdrive = 100 mV 780 ns tR Rise time Input overdrive = 100 mV 2000 ns tF Fall time Input overdrive = 100 mV 400 ns POWER SUPPLY VS Specified voltage range 2.2 36 V IO = 0 A 55 75 μA IQ Quiescent current (per channel) IO = 0 A, TA = –40°C to +125°C 100 μA TEMPERATURE Specified range –40 +125 °C Operating range –55 +150 °C Storage range –65 +150 °C THERMAL INFORMATION TLV1702 THERMAL METRIC(1) DGK (MSOP) UNITS 8 PINS θJA Junction-to-ambient thermal resistance 199 θJCtop Junction-to-case (top) thermal resistance 89.5 θJB Junction-to-board thermal resistance 120.4 °C/W ψJT Junction-to-top characterization parameter 22.0 ψJB Junction-to-board characterization parameter 118.7 θJCbot Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TLV1701 TLV1702 TLV1704 |
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