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LM3429 Datasheet(PDF) 6 Page - Texas Instruments |
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LM3429 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 50 page LM3429 SNVS616F – APRIL 2009 – REVISED JANUARY 2010 www.ti.com Electrical Characteristics (1) (continued) Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only. Unless otherwise stated the following condition applies: VIN = +14V. Min Typ Max Symbol Parameter Conditions Units (2) (3) (2) Transconductance ICSH = 100 µA 250 500 kHz Bandwidth (4) GATE DRIVER (GATE) RSRC(GATE) GATE Sourcing Resistance GATE = High 2.0 6.0 Ω RSNK(GATE) GATE Sinking Resistance GATE = Low 1.3 4.5 UNDER-VOLTAGE LOCKOUT and DIM INPUT (nDIM) VTH-nDIM nDIM / UVLO Threshold 1.180 1.240 1.280 V IHYS-nDIM nDIM Hysteresis Current 10 20 30 µA THERMAL SHUTDOWN TSD Thermal Shutdown (4) 165 Threshold °C THYS Thermal Shutdown (4) 25 Hysteresis THERMAL RESISTANCE θJA Junction to Ambient 14L TSSOP EP 40 °C/W (5) θJC Junction to Exposed Pad 14L TSSOP EP 5.5 °C/W (DAP) (5) Junction-to-ambient thermal resistance is highly board-layout dependent. The numbers listed in the table are given for a reference layout wherein the 14L TSSOP EP package has its DAP pad populated with 9 vias. In applications where high maximum power dissipation exists, namely driving a large MosFET at high switching frequency from a high input voltage, special care must be paid to thermal dissipation issues during board design. In high-power dissipation applications, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). In most applications there is little need for the full power dissipation capability of this advanced package. Under these circumstances, no vias would be required and the thermal resistances would be 104 °C/W for the 14L TSSOP EP. It is possible to conservatively interpolate between the full via count thermal resistance and the no via count thermal resistance with a straight line to get a thermal resistance for any number of vias in between these two limits. 6 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Links: LM3429 |
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