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TPS84410 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS84410 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 35 page TPS84410 SLVSAR5A – SEPTEMBER 2011 – REVISED MARCH 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) ORDERABLE TRANSPORT MINIMUM TA PACKAGE PINS ECO PLAN NUMBER MEDIA QUANTITY 500 Green (RoHS and TPS84410RKGR Tape and Reel no Sb/Br) Plastic Quad Flat -40°C to 85°C 39 Pack (BQFN) 250 Green (RoHS and TPS84410RKGT Tape and Reel no Sb/Br) (1) For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating temperature range (unless otherwise noted) VALUE UNIT MIN MAX VIN, PWRGD –0.3 7 V INH/UVLO, RT/CLK –0.3 3.3 V Input Voltage SS/TR, STSEL, VADJ –0.3 3 V SENSE+ VADJ rating must also be met -0.3 VOUT V PH –0.6 7 V Output Voltage PH 10ns Transient –2 7 V VOUT -0.6 VIN V VDIFF (GND to exposed thermal pad) –0.2 0.2 V RT/CLK, INH/UVLO ±100 µA Source Current PH Current Limit A PH Current Limit A Sink Current SS/TR ±100 µA PWRGD 10 mA Operating Junction Temperature –40 125(2) °C Storage Temperature –65 150 °C Mechanical Shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 1500 G Mechanical Vibration Mil-STD-883D, Method 2007.2, 20-2000Hz 20 (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) See the temperature derating curves in the Typical Characteristics section for thermal information. 2 Copyright © 2011–2012, Texas Instruments Incorporated |
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