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CSD18537NQ5A Datasheet(PDF) 2 Page - Texas Instruments |
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CSD18537NQ5A Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 15 page  CSD18537NQ5A SLPS391A – JUNE 2013 – REVISED FEBRUARY 2014 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 4 Specifications 4.1 Electrical Characteristics (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Static Characteristics BVDSS Drain-to-Source Voltage VGS = 0 V, ID = 250 μA 60 V IDSS Drain-to-Source Leakage Current VGS = 0 V, VDS = 48 V 1 μA IGSS Gate-to-Source Leakage Current VDS = 0 V, VGS = 20 V 100 nA VGS(th) Gate-to-Source Threshold Voltage VDS = VGS, ID = 250 μA 2.6 3.0 3.5 V VGS = 6 V, ID = 12 A 13 17 m Ω RDS(on) Drain-to-Source On Resistance VGS = 10 V, ID = 12 A 10 13 m Ω gfs Transconductance VDS = 30 V, ID = 12 A 62 S Dynamic Characteristics Ciss Input Capacitance 1140 1480 pF Coss Output Capacitance VGS = 0 V, VDS = 30 V, f = 1 MHz 136 177 pF Crss Reverse Transfer Capacitance 4 5.2 pF RG Series Gate Resistance 5.5 11.0 Ω Qg Gate Charge Total (10 V) 14 18 nC Qgd Gate Charge Gate to Drain 2.3 nC VDS = 30 V, ID = 12 A Qgs Gate Charge Gate to Source 4.7 nC Qg(th) Gate Charge at Vth 3.3 nC Qoss Output Charge VDS = 30 V, VGS = 0 V 25 nC td(on) Turn On Delay Time 5.8 ns tr Rise Time 4.0 ns VDS = 30 V, VGS = 10 V, IDS = 12 A, RG = 0 Ω td(off) Turn Off Delay Time 14.4 ns tf Fall Time 3.2 ns Diode Characteristics VSD Diode Forward Voltage ISD = 12 A, VGS = 0 V 0.8 1 V Qrr Reverse Recovery Charge 54 nC VDS= 30 V, IF = 12 A, di/dt = 300 A/μs trr Reverse Recovery Time 40 ns 4.2 Thermal Characteristics (TA = 25°C unless otherwise stated) PARAMETER MIN TYP MAX UNIT RθJC Thermal Resistance Junction to Case(1) 1.3 °C/W RθJA Thermal Resistance Junction to Ambient(1)(2) 50 °C/W (1) RθJC is determined with the device mounted on a 1-inch 2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design. (2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu. 2 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: CSD18537NQ5A |
Similar Part No. - CSD18537NQ5A_14 |
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Similar Description - CSD18537NQ5A_14 |
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