Approval sheet

Page 7 of 9

ASC_WR_V21

Mar.- 2012

TEST AND REQUIREMENTS

Essentially all tests are carried out according to the schedule of IEC publication 115-8, category

LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp

heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.

The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical

robustness testing procedure for electronic components" and under standard atmospheric conditions according

to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :

Temperature: 15°C to 35°C.

Relative humidity: 45% to 75%.

Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).

All soldering tests are performed with midly activated flux.

REQUIREMENT

TEST

PROCEDURE / TEST METHOD

Resistor

0

Ω

Ω

Ω

Ω

Electrical

Characteristics

JISC5201-1: 1998

Clause 4.8

Natural resistance change per change in degree centigrade.

(

)

6

1

2

1

1

2

10

×

−

−

t

t

R

R

R

(ppm/

Within the specified tolerance

Refer to “QUICK REFERENCE

DATA”

<50m

Ω

Resistance to

soldering heat(R.S.H)

JISC5201-1:1998

Clause 4.18

Un-mounted chips completely immersed for 10±1second in a SAC

solder bath at 260℃±5ºC

±5%:∆R/Rmax.±(1%+0.05Ω)

±1%:∆R/Rmax.±(0.5%+0.05Ω)

no visible damage

<50m

Ω

Solderability

JISC5201-1: 1998

Clause 4.17

Un-mounted chips completely immersed for 2±0.5 second in a SAC

solder bath at 235℃±5℃

95% coverage min., good tinning and no

visible damage

Temperature cycling

JISC5201-1: 1998

Clause 4.19

30 minutes at -55

°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes at

+155

°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous cycles

±5%: ∆R/R max. ±(1%+0.05Ω)

±1%:∆R/Rmax.±(0.5%+0.05Ω)

No visible damage

<50m

Ω

High Temperature

Exposure

MIL-STD-202

method 108

1000+48/-0 hours; without load in a temperature chamber

controlled 155

±3°C

±5%:∆R/Rmax.±(2%+0.1Ω)

±1%:∆R/Rmax.±(1%+0.1Ω)

No visible damage

<50m

Ω

Bending strength

JISC5201-1: 1998

Clause 4.33

Resistors mounted on a 90mm glass epoxy resin PCB(FR4), bending

once 3mm for 10sec, 5mm for WR04

±5%:∆R/Rmax.±(1%+0.05Ω)

±1%:∆R/Rmax.±(1%+0.05Ω)

No visual damaged

<50m

Ω

Adhesion

JISC5201-1: 1998

Clause 4.32

Pressurizing force: 5N, Test time: 10±1sec.

No remarkable damage or removal of the

terminations

Short Time Overload

(STOL)

JISC5201-1: 1998

Clause 4.13

2.5 times RCWV or max. overload voltage, for 5seconds

±5%: ∆R/R max. ±(2%+0.05Ω)

±1%: ∆R/R max. ±(1%+0.05Ω)

No visible damage

<50m

Ω