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TPS62160 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS62160 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 35 page TPS62160 TPS62161, TPS62162, TPS62163 SLVSAM2C – NOVEMBER 2011 – REVISED SEPTEMBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION(1) PACKAGE TA OUTPUT VOLTAGE PART NUMBER(2) PACKAGE ORDERING MARKING adjustable TPS62160 TPS62160DSG QTV 1.8 V TPS62161 TPS62161DSG QUB 8-Pin WSON -40°C to 85°C 3.3 V TPS62162 TPS62162DSG QUC 5.0 V TPS62163 TPS62163DSG QUD adjustable TPS62160 8-Pin MSOP TPS62160DGK 62160 (1) For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet. (2) Contact the factory to check availability of other fixed output voltage versions. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VIN –0.3 to 20 V Pin voltage range(2) EN, SW –0.3 to VIN+0.3 V FB, PG, VOS –0.3 to 7 V Power Good sink current PG 10 mA Operating junction temperature range, TJ –40 to 125 Temperature range °C Storage temperature range, Tstg –65 to 150 HBM Human body model 2 kV ESD rating(3) CDM Charge device model 0.5 kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. (2) All voltages are with respect to network ground terminal. (3) ESD testing is performed according to the respective JESD22 JEDEC standard. THERMAL INFORMATION TPS6216X THERMAL METRIC(1) UNITS DSG (8) DGK (8) PINS PINS θJA Junction-to-ambient thermal resistance 61.8 184.3 θJC(TOP) Junction-to-case(top) thermal resistance 61.3 74.6 θJB Junction-to-board thermal resistance 15.5 105.8 °C/W ψJT Junction-to-top characterization parameter 0.4 13.3 ψJB Junction-to-board characterization parameter 15.4 104.2 θJC(BOTTOM) Junction-to-case(bottom) thermal resistance 8.6 - (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT Supply Voltage, VIN 3 17 V Operating free air temperature, TA –40 85 °C Operating junction temperature, TJ –40 125 °C 2 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: TPS62160 TPS62161 TPS62162 TPS62163 |
Similar Part No. - TPS62160_14 |
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Similar Description - TPS62160_14 |
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