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INPUT VOLTAGE (V)

LM4570

SNOSAV2B – APRIL 2006 – REVISED JULY 2009

www.ti.com

Figure 20. Power Dissipation vs. Input Voltage

EXPOSED-DAP MOUNTING CONSIDERATIONS

The LM4570 is available in an 8-pin WSON package which features an exposed DAP (die attach paddle). The

exposed DAP provides a direct thermal conduction path between the die and the PCB, improving the thermal

performance by reducing the thermal resistance of the package. Connect the exposed DAP to GND through a

large pad beneath the device, and multiple vias to a large unbroken GND plane. For best thermal performance,

connect the DAP pad to a GND plane on an outside layer of the PCB. Connecting the DAP to a plane on an

inner layer will result in a higher thermal resistance. Ensure efficient thermal conductivity by plugging and tenting

the vias with plating and solder mask, respectively.

POWER SUPPLY BYPASSING

as close to the device as possible. Typical applications employ a regulator with a 10µF tantalum or electrolytic

capacitor and a ceramic bypass capacitor which aid in supply stability. This does not eliminate the need for

SHUTDOWN FUNCTION

The LM4570 features a low power shutdown mode that disables the device and reduces quiescent current

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