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LBM2016TR33J Datasheet(PDF) 11 Page - Taiyo Yuden (U.S.A.), Inc |
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LBM2016TR33J Datasheet(HTML) 11 Page - Taiyo Yuden (U.S.A.), Inc |
11 / 12 page ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_wound_CB_LB_prec_e-E02R01 WIRE-WOUND CHIP INDUCTORS (LB SERIES), WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES), WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE) ■PRECAUTIONS 1.Circuit Design Precautions ◆Operating environment 1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. 2.PCB Design Precautions ◆Land pattern design 1. Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications. Technical considerations PRECAUTIONS 【Recommended Land Patterns】 Surface Mounting ・ Mounting and soldering conditions should be checked beforehand. ・ Applicable soldering process to those products is reflow soldering only. 3.Considerations for automatic placement Precautions ◆Adjustment of mounting machine 1. Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2. Mounting and soldering conditions should be checked beforehand. Technical considerations 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. 4.Soldering Precautions ◆Reflow soldering( LB and CB Types) 1. For reflow soldering with either leaded or lead-free solder, the profile specified in "point for controlling" is recommended. ◆Recommended conditions for using a soldering iron 1. Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350℃ Duration-3 seconds or less. The soldering iron should not come in contact with inductor directly. Technical considerations ◆Reflow soldering( LB and CB Types) 1. Reflow profile ◆Recommended conditions for using a soldering iron 1. Components can be damaged by excessive heat where soldering conditions exceed the specified range. 5.Cleaning Precautions ◆Cleaning conditions Washing by supersonic waves shall be avoided. Technical considerations ◆Cleaning conditions If washed by supersonic waves, the products might be broken. |
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