DRV8601

SLOS629B

– JULY 2010 – REVISED JANUARY 2012

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Pin Functions

PIN

INPUT/OUTPUT/

DESCRIPTION

POWER (I/O/P)

NAME

BALL (ZQV)

PIN (DRB)

IN1

C3

4

I

Input to driver

IN2

C2

3

I

Input to driver

OUT+

B3

5

O

Positive output

OUT-

A1

8

O

Negative output

REFOUT

C1

2

O

Reference voltage output

EN

B1

1

I

Chip enable

VDD

A3

6

P

Supply voltage

GND

B2

7

P

Ground

ORDERING INFORMATION

MicroStar Junior

™

QFN Package

(ZQV)

(DRB)

Device

Symbolization

HSMI

8601

(1)

The ZQV packages are only available taped and reeled. The suffix R

designates taped and reeled parts in quantities of 2500.

(2)

For the most current package and ordering information, see the

Package Option Addendum at the end of this document or visit the

TI website at www.ti.com

THERMAL INFORMATION

DRV8601

UNITS

ZQV (8 BALLS)

DRB (8 PINS)

Junction-to-ambient thermal resistance

78

52.8

Junction-to-case (top) thermal resistance

155

63

Junction-to-board thermal resistance

65

28.4

°C/W

Junction-to-top characterization parameter

5

2.7

Junction-to-board characterization parameter

50

28.6

Junction-to-case (bottom) thermal resistance

n/a

11.4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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© 2010–2012, Texas Instruments Incorporated

Product Folder Link(s): DRV8601