DDC112

2

SBAS085B

www.ti.com

AGND to DGND ...............................................................................

±0.3V

Thermal Resistance, SO,

θ

Thermal Resistance, TQFP,

θ

Lead Temperature (soldering, 10s) ............................................... +300

°C

NOTE: (1) Stresses above those listed under

Absolute Maximum Ratings may

cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

MAXIMUM

SPECIFICATION

INTEGRAL

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

LINEARITY ERROR

RANGE

PACKAGE-LEAD

DESIGNATOR

MEDIA

DDC112U

±0.025% Reading ±1.0ppm FSR

–40

°C to +85°C

SO-28

DW

DDC112U

Rails

""

"

"

"

DDC112U/1K

Tape and Reel

DDC112UK

±0.025% Reading ±1.0ppm FSR

0

°C to +70°C

SO-28

DW

DDC112UK

Rails

""

"

"

"

DDC112UK/1K

Tape and Reel

DDC112Y

±0.025% Reading ±1.0ppm FSR

–40

°C to +85°C

TQFP-32

PJT

DDC112Y/250

Tape and Reel

""

"

"

"

DDC112Y/2K

Tape and Reel

DDC112YK

±0.025% Reading ±1.0ppm FSR

0

°C to +70°C

TQFP-32

PJT

DDC112YK/250

Tape and Reel

""

"

"

"

DDC112YK/2K

Tape and Reel

NOTES: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. (2) Models with a slash

(/) are available only in Tape and Reel in the quantities indicated (/1K indicates 1000 devices per reel). Ordering 1000 pieces of

DDC112U/1K will get a single 1000-

piece Tape and Reel.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.