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SSM3K324R Datasheet(PDF) 1 Page - Toshiba Semiconductor

Part # SSM3K324R
Description  TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

SSM3K324R Datasheet(HTML) 1 Page - Toshiba Semiconductor

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SSM3K324R
2012-12-21
1
TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type
SSM3K324R
Power Management Switch Applications
DC-DC Converter
• 1.8V drive
• Low ON-resistance: RDS(ON) = 56 mΩ (max) (@VGS = 4.5 V)
: RDS(ON) = 72 mΩ (max) (@VGS = 2.5 V)
: RDS(ON) = 109 mΩ (max) (@VGS = 1.8 V)
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Drain-source voltage
VDSS
30
V
Gate-source voltage
VGSS
±12
V
Drain current
DC
ID(Note 1)
4.0
A
Pulse
IDP(Note 1,2)
10
Power dissipation
PD (Note 3)
1
W
t
10s
2
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55 to 150
°C
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The channel temperature should not exceed 150
°C during use.
Note 2: PW
10ms,Duty
1
Note 3: Mounted on a FR4 board.
(25.4 mm
× 25.4 mm × 1.6 mm, Cu Pad: 645 mm2)
Marking
Equivalent Circuit (top view)
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
Thermal resistance Rth (ch-a) and power dissipation PD vary depending on board material, board area, board thickness
and pad area. When using this device, please take heat dissipation into consideration.
Unit: mm
JEDEC
JEITA
TOSHIBA
2-3Z1A
Weight: 11 mg (typ.)
1. Gate
2. Source
3. Drain
SOT-23F
KFD
1
2
3
1
2
3


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