Features

Applications

Surface Mount Devices

Almost anywhere there is a low voltage

Lead free device

power supply, up to 15V and a load to be

Size 1.5*0.8 mm / 0.06*0.03 inch

protected, including:

Surface Mount packaging

Computer mother board, Modem. USB hub

for automated assembly

PDAs & Charger, Analog & digital line card

Digital cameras, Disk drivers, CD-ROMs,

D

E

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Min.

DSM010

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

DSM020

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

DSM025

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

DSM035

1.45

1.85

0.65

1.05

0.40

1.00

0.15

0.10

DSM050

1.45

1.85

0.65

1.05

0.50

1.10

0.15

0.10

DSM075

1.45

1.85

0.65

1.05

0.50

1.10

0.15

0.10

DSM100

1.45

1.85

0.65

1.05

0.50

1.10

0.15

0.10

Test

Conditions

Resistance change

Passive aging

+85°C, 1000 hrs.

±5% typical

Humidity aging

+85°C, 85% R.H. , 168 hours

±5% typical

Thermal shock

+85°C to -40°C, 20 times

±33% typical

Resistance to solvent

MIL-STD-202,Method 215

No change

Vibration

MIL-STD-202,Method 201

No change

Ambient operating conditions : - 40 °C to +85 °C

Maximum surface temperature of the device in the tripped state is 125 °C

Terminal pad materials

Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper

Terminal pad solderability

Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.

Model

Environmental Specifications

Termination pad characteristics

Dimensions(mm)

Product dimensions (mm)

C

A

B

C

D

E

A

B

1

1.0士0.1

0.7士0.1

0.7 士0.1

PPTC/DSM Series

01 | www.spsemi.cn

REV.2014.05.01