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ZXTD3M832 Datasheet(PDF) 2 Page - Diodes Incorporated |
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ZXTD3M832 Datasheet(HTML) 2 Page - Diodes Incorporated |
2 / 6 page ZXTD3M832 SEMICO NDUC TORS ISSUE 1 - JUNE 2003 2 PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a)(f) R JA 83.3 C/W Junction to Ambient (b)(f) R JA 51 C/W Junction to Ambient (b)(f) R JA 125 C/W Junction to Ambient (d)(f) R JA 111 C/W Junction to Ambient (d)(g) R JA 73.5 C/W Junction to Ambient (e)(g) R JA 41.7 C/W NOTES (a) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (b) Measured at t 5 secs for a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (c) For a dual device surface mounted on 8 sq cm single sided 2oz copper FR4 PCB, in still air conditions with minimal lead connections only. (d) For a dual device surface mounted on 10 sq cm single sided 1oz copper FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (e) For a dual device surface mounted on 85 sq cm single sided 2oz copper FR4 PCB, in still air conditions with all exposed pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device. (f) For dual device with one active die. (g) For dual device with 2 active die running at equal power. (h) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph. (i) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in the package dimensions data. The thermal resistance for a dual device mounted on 1.5mm thick FR4 board using minimum copper of 1 oz weight, 1mm wide tracks and one half of the device active is Rth= 250°C/W giving a power rating of Ptot=500mW THERMAL RESISTANCE PARAMETER SYMBOL LIMIT UNIT Collector-Base Voltage VCBO -50 V Collector-Emitter Voltage VCEO -40 V Emitter-Base Voltage VEBO -7.5 V Peak Pulse Current ICM -4 A Continuous Collector Current (a) (f) IC -3 A Base Current IB -1000 mA Power Dissipation at TA=25°C (a)(f) Linear Derating Factor PD 1.5 12 W mW/ C Power Dissipation at TA=25°C (b)(f) Linear Derating Factor PD 2.45 19.6 W mW/ C Power Dissipation at TA=25°C (c)(f) Linear Derating Factor PD 1 8 W mW/ C Power Dissipation at TA=25°C (d)(f) Linear Derating Factor PD 1.13 9 W mW/ C Power Dissipation at TA=25°C (d)(g) Linear Derating Factor PD 1.7 13.6 W mW/ C Power Dissipation at TA=25°C (e)(g) Linear Derating Factor PD 3 24 W mW/ C Operating & Storage Temperature Range Tj:Tstg -55 to +150 C Junction Temperature Tj 150 C ABSOLUTE MAXIMUM RATINGS OBSOLETE - PLEASE USE ZXTD720MC |
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