ZXTEM322

SEMICO NDUC TORS

ISSUE 2 - JUNE 2006

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient

(a)

83

C/W

Junction to Ambient

(b)

51

C/W

Junction to Ambient

(d)

125

C/W

Junction to Ambient

(e)

42

C/W

NOTES

attached.

(c) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph.

(d) For a single device surface mounted on 10 sq cm 1oz copper FR4 PCB, in still air conditions with minimal lead connections only.

(e) For a single device surface mounted on 65 sq cm 2oz copper FR4 PCB, in still air conditions with all exposed pads attached.

(f) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device, as shown in

the package dimensions data. The thermal resistance for a device mounted on 1.5mm thick FR4 board using minimum copper of 1oz weight and

1mm wide tracks is Rth= 300°C/W giving a power rating of Ptot=420mW

THERMAL RESISTANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Collector-Base Voltage

100

V

Collector-Emitter Voltage

80

V

Emitter-Base Voltage

7.5

V

Peak Pulse Current

5A

Continuous Collector Current

(a)

3.5

A

Base Current

1000

mA

Power Dissipation at TA=25°C

(a)

Linear Derating Factor

1.5

12

W

mW/ C

Power Dissipation at TA=25°C

(b)

Linear Derating Factor

2.45

19.6

W

mW/ C

Power Dissipation at TA=25°C

(d)

Linear Derating Factor

1

8

W

mW/ C

Power Dissipation at TA=25°C

(e)

Linear Derating Factor

3

24

W

mW/ C

Operating & Storage Temperature Range

-55 to +150

C

Junction Temperature

150

C

ABSOLUTE MAXIMUM RATINGS

OBSOLETE - PLEASE USE ZXTN620MA