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OPA627 Datasheet(PDF) 2 Page - Texas Instruments

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Part # OPA627
Description  HIGH-VOLTAGE, HIGH SLEW RATE, WIDEBAND FET-INPUT OPERATIONAL AMPLIFIER
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA627 Datasheet(HTML) 2 Page - Texas Instruments

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THS4631
SLOS451B
– DECEMBER 2004 – REVISED AUGUST 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
UNITS
VS
Supply voltage, VS– to VS+
33 V
VI
Input voltage
±VS
IO
(2)
Output current
150 mA
Continuous power dissipation
See Dissipation Rating Table
TJ
Maximum junction temperature(2)
150
°C
TA
Operating free-air temperature, continues operation, long-term reliability(2)
125
°C
Tstg
Storage temperature range
–65°C to 150°C
HBM
1000 V
ESD ratings:
CDM
1500 V
MM
100 V
(1)
The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2)
The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
PACKAGE DISSIPATION RATINGS
POWER RATING(1) (TJ =125°C)
PACKAGE
θJC (°C/W)
θJA (°C/W)
TA ≤ 25°C
TA = 85°C
D (8)(2)
38.3
95
1.1 W
0.47 W
DDA (8)
9.2
45.8
2.3 W
0.98 W
DGN (8)
4.7
58.4
2.14 W
1.11 W
(1)
Power rating is determined with a junction temperature of 125
°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125
°C for best performance.
(2)
This data was taken using the JEDEC standard High-K test PCB.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNITS
Dual Supply
±5
±15
VS
Supply Voltage
V
Single Supply
10
30
TA
Operating free-air temperature
-40
85
°C
2
Copyright
© 2004–2011, Texas Instruments Incorporated


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