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THS3110 Datasheet(PDF) 3 Page - Texas Instruments |
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THS3110 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 38 page THS3110 THS3111 www.ti.com........................................................................................................................................ SLOS422E – SEPTEMBER 2003 – REVISED OCTOBER 2009 RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Dual supply ±5 ±15 Supply voltage V Single supply 10 30 Commercial 0 +70 Operating free-air temperature, TA Industrial –40 +85 °C Operating junction temperature, continuous operating temperature, TJ –40 +125 Normal storage temperature, TSTG –40 +85 ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature, unless otherwise noted. UNIT Supply voltage, VS– to VS+ 33 V Input voltage, VI ± VS Differential input voltage, VID ± 4 V Output current, IO (2) 300 mA Continuous power dissipation See Dissipation Ratings Table Maximum junction temperature, TJ (3) +150°C Maximum junction temperature, continuous operation, long term reliability, TJ (4) +125°C Commercial 0°C to +70°C Operating free-air temperature, TA Industrial –40°C to +85°C Storage temperature, Tstg –65°C to +125°C ESD ratings: HBM 900 CDM 1500 MM 200 (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The THS3110 and THS3111 may incorporate a PowerPAD on the underside of the chip. This feature acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD™ thermally-enhanced package. (3) The absolute maximum temperature under any condition is limited by the constraints of the silicon process. (4) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. Copyright © 2003–2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): THS3110 THS3111 |
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