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LMH7322 Datasheet(PDF) 2 Page - Texas Instruments |
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LMH7322 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 33 page LMH7322 SNOSAU8H – MARCH 2007 – REVISED MAY 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) ESD Tolerance (3) Human Body Model 2.5 kV Machine Model 250V Output Short Circuit Duration See (4)(5)(6) Supply Voltages (VCCx–VEE) 13.2V Differential Voltage at Input Pins ±13V Voltage at Input Pins VEE-0.2V to VCCI + 0.2V Voltage at LE Pins VEE-0.2V to VCCO+0.2V Current at Output Pins 25mA Soldering Information: See Product Folder at www.ti.com and SNOA549 Storage Temperature Range −65°C to +150°C Junction Temperature (7) +150°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. (5) Short circuit test is a momentary test. See next note. (6) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. (7) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Operating Conditions (1) Supply Voltage (VCCx–VEE) 2.7V to 12V Operating Temperature Range (2) (3) −40°C to +125°C Package Thermal Resistance (2) (3) 24-Pin WQFN 38°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. (3) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Applications section for information on temperature de-rating of this device. 2 Submit Documentation Feedback Copyright © 2007–2011, Texas Instruments Incorporated Product Folder Links: LMH7322 |
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