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LMH6552SDXNOPB Datasheet(PDF) 2 Page - Texas Instruments |
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LMH6552SDXNOPB Datasheet(HTML) 2 Page - Texas Instruments |
2 / 30 page LMH6552 SNOSAX9G – APRIL 2007 – REVISED JULY 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) ESD Tolerance (2) Human Body Model 2000V Machine Model 200V Supply Voltage 13.2V Common Mode Input Voltage ±VS Maximum Input Current (pins 1, 2, 7, 8) 30 mA Maximum Output Current (pins 4, 5) (3) Maximum Junction Temperature 150°C Soldering Information For soldering specifications see SNOA549C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables. (2) Human Body Model, applicable std. MIL-STD-883, Method 30157. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (3) The maximum output current (IOUT) is determined by device power dissipation limitations. See POWER DISSIPATION of Application Information for more details. Operating Ratings (1) Operating Temperature Range (2) −40°C to +85°C Storage Temperature Range −65°C to +150°C Total Supply Voltage 4.5V to 12V Package Thermal Resistance ( θJA) 8-Pin SOIC 150°C/W 8-Pin WSON 58°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables. (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)– TA) / θJA. All numbers apply for packages soldered directly onto a PC Board. 2 Submit Documentation Feedback Copyright © 2007–2011, Texas Instruments Incorporated Product Folder Links: LMH6552 |
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