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LMH6552 Datasheet(PDF) 2 Page - Texas Instruments

Part # LMH6552
Description  1.5 GHz Fully Differential Amplifier
Download  30 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LMH6552 Datasheet(HTML) 2 Page - Texas Instruments

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LMH6552
SNOSAX9G – APRIL 2007 – REVISED JULY 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
ESD Tolerance (2)
Human Body Model
2000V
Machine Model
200V
Supply Voltage
13.2V
Common Mode Input Voltage
±VS
Maximum Input Current (pins 1, 2, 7, 8)
30 mA
Maximum Output Current (pins 4, 5)
(3)
Maximum Junction Temperature
150°C
Soldering Information
For soldering specifications see SNOA549C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the
Electrical Characteristics tables.
(2)
Human Body Model, applicable std. MIL-STD-883, Method 30157. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3)
The maximum output current (IOUT) is determined by device power dissipation limitations. See POWER DISSIPATION of Application
Information for more details.
Operating Ratings
(1)
Operating Temperature Range (2)
−40°C to +85°C
Storage Temperature Range
−65°C to +150°C
Total Supply Voltage
4.5V to 12V
Package Thermal Resistance (
θJA)
8-Pin SOIC
150°C/W
8-Pin WSON
58°C/W
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the
Electrical Characteristics tables.
(2)
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX)– TA) / θJA. All numbers apply for packages soldered directly onto a PC Board.
2
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Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Links: LMH6552


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