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BUF11704 Datasheet(PDF) 2 Page - Texas Instruments |
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BUF11704 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 32 page BUF12840 SBOS519A – OCTOBER 2010 – REVISED JULY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PACKAGE PRODUCT PACKAGE DESIGNATOR PACKAGE MARKING TRANSPORT MEDIA, QUANTITY BUF12840 VQFN-24 RGE BUF12840 Tape and Reel, 3000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at ti.com. ABSOLUTE MAXIMUM RATINGS (1) PARAMETER BUF12840 UNIT Supply Voltage VS +22 V Supply Voltage VSD +6 V Supply Input Terminals, SCL, SDA, A0, BKSEL, EA0, EA1, EN, LD: Voltage –0.5 to +6 V Supply Input Terminals, SCL, SDA, A0, BKSEL, EA0, EA1, EN, LD: Current ±10 mA Output Short-Circuit(2) Continuous Operating Temperature –40 to +95 °C Storage Temperature –65 to +150 °C Junction Temperature TJ +125 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Short-circuit to ground. Exposed thermal die is soldered to the PCB using thermal vias. Refer to Texas Instruments application report QFN/SON PCB Attachment (SLUS271). THERMAL INFORMATION BUF12840 THERMAL METRIC(1) RGE UNITS 24 PINS θJA Junction-to-ambient thermal resistance 35.6 θJC(top) Junction-to-case(top) thermal resistance 40.5 θJB Junction-to-board thermal resistance 10.0 °C/W ψJT Junction-to-top characterization parameter 0.5 ψJB Junction-to-board characterization parameter 9.9 θJC(bottom) Junction-to-case(bottom) thermal resistance 3.0 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Copyright © 2010–2011, Texas Instruments Incorporated |
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