TECHNICAL DATA SHEET

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SMTJACK RECEPTACLE

R223.424.000

-

Series : MMBX

Issue : 0736 B

In the effort to improve our products, we reserve the right to make changes judged to be

necessary.

1.

Deposit solder paste ‘SnAg4Cu0.5’ on mounting zone by screen printing application. We recommend a low residue

flux.

We advise a thickness of 150 micromm ( 5.850 microinch ). Verify that the edges of the zone are clean.

2.

Placement of the receptacle on the mounting zone with an automatic machine of ‘pick and place’ type.

A video camera is recommended for positioning of the component.

Adhesive agents must not be used on the receptacle.

3.

This process of soldering has been tested with convection oven.

Below please find, the typical profile to use.

4.

The cleaning of printed circuit boards is not obliged.

5.

Verification of solder joints and position of the component by visual inspection.

TEMPERATURE PROFILE

Parameter

Value

Unit

Temperature rising Area

1 - 4

°C/sec

Max Peak Temperature

260

°C

Max dwell time @260°C

10

sec

Min dwell time @235°C

20

sec

Max dwell time @235°C

60

sec

Temperature drop in cooling Area

-1 to - 4

°C/sec

Max dwell time above 100°C

420

sec