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SG7915AGDESC Datasheet(PDF) 2 Page - Microsemi Corporation |
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SG7915AGDESC Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 9 page SG79xxA / SG79xx PRODUCT DATASHEET Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 Copyright © 1997 Rev. 1.6, 2010-07-16 Negative Fixed Voltage Regulator TM ® ABSOLUTE MAXIMUM RATINGS Device Output Voltage Input Voltage Input Voltage Differential (Output Shorted to Ground) -5V -35V 35V -12V -35V 35V -15V -40V 35V Operating Junction Temperature .........................................................................................................................................................150°C Storage Temperature Range ................................................................................................................................................. -65 °C to 150°C Lead Temperature (Soldering 10 seconds) ..........................................................................................................................................300 °C Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal . THERMAL DATA K TO-3 3-Pin Metal Can THERMAL RESISTANCE -JUNCTION TO CASE, θ JC 3.0 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 35 °C/W T TO-39 3-Pin Metal Can THERMAL RESISTANCE -JUNCTION TO CASE, θ JC 15 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 120 °C/W G TO-257 3-Pin Hermetic THERMAL RESISTANCE -JUNCTION TO CASE, θ JC 3.5 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 42 °C/W IG TO-257 3-Pin Hermetic (Isolated) THERMAL RESISTANCE -JUNCTION TO CASE, θ JC 4.0 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 42 °C/W L Leadless Chip Carrier 20-Pin Ceramic THERMAL RESISTANCE -JUNCTION TO CASE, θ JC 35 °C/W THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 120 °C/W Junction Temperature Calculation: TJ = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. |
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