Rev. Feb. 2014

458 Shenhu Road, Suzhou Industrial Park, Jiangsu, P.R.C.

www.aemchina.com

Phone: 86-512-62580028, Fax: 86-512-62580018

4

Fig. 3 Recommended reflow soldering profile

1. Recommended reflow methods: IR, hot air oven, nitrogen oven.

2. Recommended maximum paste thickness: 0.25mm (0.010 inch).

3. Devices can be cleaned using standard industry methods and solvents.

4. Soldering temperature and time should not exceed the recommended conditions.

requirements.

 Operation beyond the maximum ratings or improper use may result in device damage and

possible electrical arcing and flame.

 The devices are intended for protection against occasional over-current or over-temperature

fault conditions and should not be used when repeated fault conditions or prolonged trip events

are anticipated.

 Contamination of the PPTC material with certain silicon based oils or some aggressive solvents

can adversely impact the performance of the devices.

 Device performance can be impacted negatively if devices are handled in a manner inconsistent

with recommended electronic, thermal and mechanical procedures for electronic components.

rated voltage of the PPTC device.