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PIN-HIPAX-SERIES Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc. |
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PIN-HIPAX-SERIES Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc. |
1 / 12 page High Power PIN Diodes V14 MA4P MELF & HIPAX™Series ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 1 Features ♦ High Power Handling ♦ Low Loss / Low Distortion ♦ Voltage Ratings up to 1000 Volts ♦ Passivated Chip for Low Leakage Current ♦ Low Theta (θ) Due to Full Face Chip Bonding ♦ Leadless Low Inductance MELF Packages ♦ Various Package Options ♦ Available as Chips ♦ Fully RoHS Compliant ♦ Non-Magnetic Packages Available for MRI Description M/A-COM Technology Solutions MELF and HIPAX PIN diode series are designed for usage in switch and attenuator applications requiring high power handling and low distortion. The MELF and HIPAX PIN diodes incorporate a fully passivated PIN diode chip resulting in an extremely low reverse bias leakage current. The semiconductor technology utilized in the MELF and HIPAX families draws on M/A-COM Tech’s substantial experience in PIN diode design and wafer fabrication. The result is a device which has a thick I-region and long carrier lifetime while maintaining low series resistance and capacitance values. The chips of the MELF and HIPAX PIN diodes are enclosed in a rugged ceramic package and is full face bonded to metal pins on both the anode and cathode. The result is a low loss PIN diode with low thermal resistance due to symmetrical thermal paths. The parts are offered in either magnetic or non-magnetic, HIPAX (axial leaded) or Metal Electrode Leadless Faced (MELF) surface mount packages for MRI applications. The MELF is a rectangular SMQ, package which is designed for high volume tape and reel assembly. This easy to use package design makes automatic pick and place, indexing and assembly, extremely easy. The parallel flat surfaces are suitable for most key jaw or vacuum pick-up techniques. All of the solderable surfaces are tin plated and compatible with industry standard reflow and vapor phase soldering processes. See page 7 of Application Note M538 on the M/A-COM Technology Solutions website for a typical solder reflow profile. Absolute Maximum Ratings TAMB = +25°C (Unless Otherwise Noted) 1 1.Operation of this device above any one of these parameters may cause permanent damage. Parameter Absolute Maximum D.C. Reverse Voltage (VR) (See Tables) Operating Chip Junction Temperature -55°C to +175°C Storage Temperature -55°C to +200°C Installation Temperature +280°C for 30 Seconds ESD Class 1A, HBM Package Styles Applications HIPAX PIN diodes are designed for use in a wide variety of switch and attenuator applications from HF through UHF frequencies and at power levels above 1kW, CW. The internal chip as well as each diode assembly has been comprehensively tested and characterized to ensure predictable and repeatable performance. Design Recommendations ♦Low Distortion Attenuators •MA4P4301B ♦Surface Mount Switches •MA4P7101F ♦Cellular Radio Antenna Switches • MA4P1200, MA4P1250 1072 & 1091 Notes 401 & 402 |
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