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LMA116 Datasheet(PDF) 2 Page - Filtronic Compound Semiconductors |
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LMA116 Datasheet(HTML) 2 Page - Filtronic Compound Semiconductors |
2 / 4 page Filtronic 2-10GHz MESFET Amplifier Solid State LMA116 Phone: (408) 988-1845 Internet: http://www.FiltronicSolidState.com Fax: (408) 970-9950 Assembly Diagram SINGLE VOLTAGE SUPPLY SCHEME Notes: 1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic bonding is not recommended. 2.) The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes. 3.) Bond on bond or stitch bond acceptable. 4.) Conductor over conductor acceptable. Conductors must not short. DSS 006 WC |
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