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ECJ-3FB1E474K Datasheet(PDF) 4 Page - Panasonic Semiconductor |
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ECJ-3FB1E474K Datasheet(HTML) 4 Page - Panasonic Semiconductor |
4 / 6 page – EC5 – Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Multilayer Ceramic Capacitors(High Capacitance) Item Specification Test Method Resistance to Soldering Heat Appearance : No mechanical damage Capacitance change : Temp. Char. B, X7R, X5R : within ±7.5 % F, Y5V : within ±20 % tan δ : Initial standard value IR : Initial standard value Withstand voltage : No dielectric breakdown or damage Soldering bath method Preconditioning : Heat treatment ( ✽1) Solder temperature : 270±5 °C Dipping period : 3.0±0.5 s Preheat condition : Order Temp. (°C) Size 0805 max. Size 1206 1 80 to 100 120 to 180s 300 to 360s 2 150 to 200 120 to 180s 300 to 360s Recovery (Standard condition) : 48±4 h Solderability More than 95 % of the soldered area of both terminal electrodes shall be covered with fresh solder. Soldering bath method Solder temperature : 230±5 °C Dipping period : 4±1 s Solder : H63A (JIS–Z–3282) Temperature Cycle Appearance : No mechanical damage Capacitance change : Temp. Char. B, X7R, X5R : within ±7.5 % F, Y5V : within ±20 % tan δ : Initial standard value IR : Initial standard value Withstand voltage : No dielectric breakdown and/or damage Preconditioning : Heat treatment ( ✽1) Step 1: Minimum operating temp. 30±3 min Step 2: Room temp. 3 min max. Step 3: Maximum operating temp. 30±3 min Step 4: Room temp. 3 min max. Number of cycles : 5 cycles Recovery(Standard condition) : 48±4 h Damp Heat (steady state) Appearance : No mechanical damage Capacitance change : Temp. Char. B, X7R, X5R : within ±20 % F, Y5V : within ±30 % tan δ : Temp. Char. B, X7R, X5R : 0.25 max. F, Y5V : 0.3 max. IR : 50/C (M ) min. Note : 10/C (M ) min. for rated vol. DC 10 V max. C:Nominal cap. in µF Please see the technical specifications for details. Preconditioning : Heat treatment ( ✽1) Temperature : 40±2 °C Relative humidity : 90 to 95 % Test period : 500+24/0 h Recovery(Standard condition) : 48±4 h Damp Heat Load Appearance : No mechanical damage Capacitance change : Temp. Char. B, X7R, X5R : within ±20 % F, Y5V : within ±30 % tan δ : Temp. Char. B, X7R, X5R : 0.25 max. F, Y5V : 0.3 max. IR : 25/C (M ) min. Note : 5/C (M ) min. for rated vol. DC 10 V max. C:Nominal cap. in µF Please see the technical specifications for details. Preconditioning : Voltage treatment ( ✽2) Temperature : 40±2 °C Relative humidity : 90 to 95 % Applied voltage : Rated voltage Charge/discharge current : 50 mA max. Test period : 500+24/0 h Recovery(Standard condition) : 48±4 h High Temperature Load Appearance : no mechanical damage Capacitance change : Temp. Char. B, X7R, X5R : within ±20 % F, Y5V : within ±30 % tan δ : Temp. Char. B, X7R, X5R : 0.25 max. F, Y5V : 0.3 max. IR : 50/C (M ) min. Note : 10/C (M ) min. for rated vol. DC 10 V max. C:Nominal cap. in µF Please see the technical specifications for details. Preconditioning : Voltage treatment ( ✽2) Temperature : Maximum operation temp. ±3 °C Applied voltage : (1)Rated voltage 200 % (2)Rated voltage 150 % (3)Rated voltage 100 % Please see the technical specifications for details. Charge/discharge current : 50 mA max. Test period : 1000+48/0 h Recovery (Standard condition) : 48±4 h ( ✽1) Heat treatment : 1 h of heat treatment at 150+0/–10 °C followed by 48±4 h recovery under standard conditions. ( ✽2) Voltage treatment : 1 h of voltage treatment under the specified temperature and voltage for testing followed by 48±4 h of recovery under standard conditions. 02 Dec. 2008 |
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