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AXC61S4174 Datasheet(PDF) 9 Page - Panasonic Semiconductor

Part # AXC61S4174
Description  Automation Controls Catalog
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Manufacturer  PANASONIC [Panasonic Semiconductor]
Direct Link  http://www.panasonic.com/industrial/
Logo PANASONIC - Panasonic Semiconductor

AXC61S4174 Datasheet(HTML) 9 Page - Panasonic Semiconductor

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Panasonic Corporation 2013
©
Panasonic Corporation Automation Controls Buisiness Division
industrial.panasonic.com/ac/e/
Notes on Using Micro Coaxial Connectors
9–
ACCTB12E 201303-T
• Plug
21, 41 pin contacts (#38 wire for power supply)
Recommended cable pattern
Dimension table (mm)
41 pin contacts/51 pin contacts (signal wire only)
Recommended cable pattern
Dimension table (mm)
• Receptacle
Recommended PC board pattern (mounting pad layout)
Recommended window size of metal mask
Metal mask thickness: When 120
µm
(Signal terminal portion opening area ratio: 70%)
(GND terminal portion opening area ratio: 80%)
Dimension table (mm)
• Plug
Recommended cable pattern
Dimension table (mm)
2) Reflow soldering
• Screen-printing is recommended for printing paste solder.
• To determine the relationship between the screen opening area
and the PC board foot pattern area, refer to the diagrams in the
recommended patterns for PC boards and metal masks.
Make sure to use the terminal tip as a reference position when
setting.
• Too much solder may cause solder creeping near the
contacting part or a short circuit with the shell (GND).
• Consult us when using a screen-printing thickness other than
that recommended.
• Depending on the size of the connector being used, self
alignment may not be possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature profile is given in the
figure below
• The temperature is measured on the surface of the PC board
near the connector terminal.
• Certain solder and flux types may cause serious solder
creeping.
Solder and flux characteristics should be taken into
consideration when setting the reflow soldering conditions.
• Do not apply adhesive to secure the connector, because it can
affect the spring action of the contact.
• When coating the PC board after soldering the connector to
prevent the deterioration of insulation, perform the coating in
such a way so that the coating does not get on the connector.
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use a soldering iron with a
flat tip. Do not add flux, otherwise, the flux may creep to the
contact parts.
• Use a soldering iron whose tip temperature is within the
temperature range specified in the specifications.
Number of pins/dimension
A
B
C
21
4.75
6.00
3.00
41
9.75
11.00
8.00
Number of pins/dimension
A
B
C
41
10.00
11.00
0.34
51
12.50
13.50
0.31
CF series
Number of pins/dimension
A
B
C
D
40
19.10
15.60
18.20
20.00
A
±0.1
C
±0.1
0.50
±0.05
0.25
±0.05
B
0.35
±0.03
#44
(fine diameter)
or #46
#38 (Each of
the two ends)
Z
View Z
A
±0.1
0.25
±0.05
C
±0.03
Z'
B
View Z'
Insulation
Insulation
GND connection
(4 places)
Insulation
0.40
±0.03
0.23
±0.03
0.90
±0.03
A
±0.05
B
±0.05
B
±0.05
C
±0.03
D
±0.03
0.40
±0.03
0.21
±0.02
Number of pins/dimension
A
B
40
15.60
16.60
A
±0.1
0.40
±0.05
0.31
±0.03
Y
B
View Y
Terminal
Paste
solder
PC board
foot pattern
60 to 120 sec.
Preheating
Time
Temperature
Peak temperature
200
°C
220
°C
Upper limit (Soldering heat resistance)
260
°C
230
°C
180
°C
150
°C
70 sec.
25 sec.
Lower limit (Solder wettability)


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