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AXC61S4174 Datasheet(PDF) 9 Page - Panasonic Semiconductor |
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AXC61S4174 Datasheet(HTML) 9 Page - Panasonic Semiconductor |
9 / 10 page Panasonic Corporation 2013 © Panasonic Corporation Automation Controls Buisiness Division industrial.panasonic.com/ac/e/ Notes on Using Micro Coaxial Connectors – 9– ACCTB12E 201303-T • Plug 21, 41 pin contacts (#38 wire for power supply) Recommended cable pattern Dimension table (mm) 41 pin contacts/51 pin contacts (signal wire only) Recommended cable pattern Dimension table (mm) • Receptacle Recommended PC board pattern (mounting pad layout) Recommended window size of metal mask Metal mask thickness: When 120 µm (Signal terminal portion opening area ratio: 70%) (GND terminal portion opening area ratio: 80%) Dimension table (mm) • Plug Recommended cable pattern Dimension table (mm) 2) Reflow soldering • Screen-printing is recommended for printing paste solder. • To determine the relationship between the screen opening area and the PC board foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. • Too much solder may cause solder creeping near the contacting part or a short circuit with the shell (GND). • Consult us when using a screen-printing thickness other than that recommended. • Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern. • The recommended reflow temperature profile is given in the figure below • The temperature is measured on the surface of the PC board near the connector terminal. • Certain solder and flux types may cause serious solder creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. • Do not apply adhesive to secure the connector, because it can affect the spring action of the contact. • When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 3) Reworking on a soldered portion • Finish reworking in one operation. • For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise, the flux may creep to the contact parts. • Use a soldering iron whose tip temperature is within the temperature range specified in the specifications. Number of pins/dimension A B C 21 4.75 6.00 3.00 41 9.75 11.00 8.00 Number of pins/dimension A B C 41 10.00 11.00 0.34 51 12.50 13.50 0.31 CF series Number of pins/dimension A B C D 40 19.10 15.60 18.20 20.00 A ±0.1 C ±0.1 0.50 ±0.05 0.25 ±0.05 B 0.35 ±0.03 #44 (fine diameter) or #46 #38 (Each of the two ends) Z View Z A ±0.1 0.25 ±0.05 C ±0.03 Z' B View Z' Insulation Insulation GND connection (4 places) Insulation 0.40 ±0.03 0.23 ±0.03 0.90 ±0.03 A ±0.05 B ±0.05 B ±0.05 C ±0.03 D ±0.03 0.40 ±0.03 0.21 ±0.02 Number of pins/dimension A B 40 15.60 16.60 A ±0.1 0.40 ±0.05 0.31 ±0.03 Y B View Y Terminal Paste solder PC board foot pattern 60 to 120 sec. Preheating Time Temperature Peak temperature 200 °C 220 °C Upper limit (Soldering heat resistance) 260 °C 230 °C 180 °C 150 °C 70 sec. 25 sec. Lower limit (Solder wettability) |
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