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AXC51S2150 Datasheet(PDF) 3 Page - Panasonic Semiconductor

Part # AXC51S2150
Description  Automation Controls Catalog
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Manufacturer  PANASONIC [Panasonic Semiconductor]
Direct Link  http://www.panasonic.com/industrial/
Logo PANASONIC - Panasonic Semiconductor

AXC51S2150 Datasheet(HTML) 3 Page - Panasonic Semiconductor

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Panasonic Corporation 2013
©
Panasonic Corporation Automation Controls Buisiness Division
industrial.panasonic.com/ac/e/
Micro coaxial connectors
CS
–3–
ACCTB21E 201310-T
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
1. Receptacle
2. Plug
3. Plug cover shell
Item
Specifications
Conditions
Electrical
characteristics
(Connector
unit)
Rated current
0.25A/terminal (Max. 4A at total pin contacts)
Maximum current that 1 pin contact can conduct.
(connector characteristic except cable)
Rated voltage
50V AC/DC
Insulation resistance
Min. 1,000M
Ω (initial)
Using 250 V DC megger (applied for 1 minute)
Breakdown voltage
90V AC for 1 minute
Rated voltage is applied for one minute and check for short
circuit or damage with a detection current of 1mA.
Contact resistance
Signal: Max. 70m
Ω (initial)
Ground: Max. 40m
Ω (initial)
Based on method of JIS C 5402
Applicable electrical wire
AWG #44, 46 (Outside diameter: 0.25mm or less)
AWG #38 (Outside diameter: 0.32mm or less)
#38-compatible plug only
Mechanical
characteristics
Composite insertion force
Max. 1.2
× No. of pins + 2.4N (initial)
Composite removal force
Min. 0.165
× No. of pins + 0.33N
Holding force for terminal
(Receptacle)
Contact: Min. 0.20N/terminal
Shell: Min. 0.20N/point
Measured the maximum load applied until the press-fit
terminals were removed in the axial direction.
Wire tensile strength
Min. 2.5N (Min. 21 pins)
Min. 5N (Min. 41 pins)
When all wires bundled together are pulled, the mated joint
must not break.
Pulling direction: Wire leading direction
Environmental
characteristics
Ambient temperature
–55
°C to +85°C
No freezing at low temperatures. No dew condensation.
Storage environment
–55
°C to +85°C (Product unit)
–40
°C to +50°C (Packing style)
No freezing at low temperatures. No dew condensation.
Thermal shock resistance
(Receptacle and plug
mated)
5 cycles,
insulation resistance min. 100M
Ω,
increment of contact resistance max. 40m
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(Receptacle and plug
mated)
120 hours,
insulation resistance min. 100M
Ω,
increment of contact resistance max. 40m
MIL-STD-1344A, METHOD 1002
Bath temperature 40
±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(Receptacle and plug
mated)
24 hours,
insulation resistance min. 100M
Ω,
increment of contact resistance max. 40m
MIL-STD-1344A, METHOD 1001
Bath temperature 35
±2°C, saltwater concentration 5±1%
H2S resistance
(Receptacle and plug
mated)
48 hours,
increment of contact resistance max. 40m
JEIDA-38-1984
Bath temperature 40
±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Insertion and removal life
Mechanical life: 30 times,
increment of contact resistance max. 40m
Min. 0.165 composite removal force
× No. of pins + 0.33N
Repeated insertion and removal speed of
max. 200 times/hours
Resistance to
soldering heat
Receptacle
Initial electrical and mechanical characteristics must be
maintained.
Reflow soldering: Max. peak temperature of 260
°C, 2 cycles
(PC board surface temperature of near connector terminals)
Soldering iron: 350
°C within 3s, 300°C within 5s
Plug
Initial electrical and mechanical characteristics must be
maintained.
Connecting wires portion pulse heat:
Max. peak temperature of 300
°C, 3s
(Don’t touch the heater head to molded portion)
Plug cover shell soldering portion:
Soldering iron: 350
°C within 3s, 300°C within 5s
Part name
Material
Color
Surface treatment
Molded portion
LCP resin (UL 94V-0)
Black
Contact
Copper alloy
Contact portion:
Ni plating on base, Au plating on surface (Min. 0.1
µm)
Soldering portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
Shell
Copper alloy
Contact portion:
Ni plating on base, Au plating on surface
Soldering portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
Part name
Material
Color
Surface treatment
Molded portion
LCP resin (UL 94V-0)
Black
Post
Copper alloy
Contact portion:
Ni plating on base, Au plating on surface (Min. 0.1
µm)
Soldering wire portion: Ni plating on base, Au plating on surface
Insert shell
Copper alloy
Ni plating
Part name
Material
Color
Surface treatment
Shell
Copper alloy
Ni plating on base, Au plating on surface
Order Temperature (
°C)
Time (minutes)
1
2
3
4
–55
85
–55
0
−3
30
Max. 5
30
Max. 5
+3
0
0
−3


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