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AXC51S2150 Datasheet(PDF) 3 Page - Panasonic Semiconductor |
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AXC51S2150 Datasheet(HTML) 3 Page - Panasonic Semiconductor |
3 / 10 page Panasonic Corporation 2013 © Panasonic Corporation Automation Controls Buisiness Division industrial.panasonic.com/ac/e/ Micro coaxial connectors CS –3– ACCTB21E 201310-T SPECIFICATIONS 1. Characteristics 2. Material and surface treatment 1. Receptacle 2. Plug 3. Plug cover shell Item Specifications Conditions Electrical characteristics (Connector unit) Rated current 0.25A/terminal (Max. 4A at total pin contacts) Maximum current that 1 pin contact can conduct. (connector characteristic except cable) Rated voltage 50V AC/DC Insulation resistance Min. 1,000M Ω (initial) Using 250 V DC megger (applied for 1 minute) Breakdown voltage 90V AC for 1 minute Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1mA. Contact resistance Signal: Max. 70m Ω (initial) Ground: Max. 40m Ω (initial) Based on method of JIS C 5402 Applicable electrical wire AWG #44, 46 (Outside diameter: 0.25mm or less) AWG #38 (Outside diameter: 0.32mm or less) #38-compatible plug only Mechanical characteristics Composite insertion force Max. 1.2 × No. of pins + 2.4N (initial) Composite removal force Min. 0.165 × No. of pins + 0.33N Holding force for terminal (Receptacle) Contact: Min. 0.20N/terminal Shell: Min. 0.20N/point Measured the maximum load applied until the press-fit terminals were removed in the axial direction. Wire tensile strength Min. 2.5N (Min. 21 pins) Min. 5N (Min. 41 pins) When all wires bundled together are pulled, the mated joint must not break. Pulling direction: Wire leading direction Environmental characteristics Ambient temperature –55 °C to +85°C No freezing at low temperatures. No dew condensation. Storage environment –55 °C to +85°C (Product unit) –40 °C to +50°C (Packing style) No freezing at low temperatures. No dew condensation. Thermal shock resistance (Receptacle and plug mated) 5 cycles, insulation resistance min. 100M Ω, increment of contact resistance max. 40m Ω Conformed to MIL-STD-202F, method 107G Humidity resistance (Receptacle and plug mated) 120 hours, insulation resistance min. 100M Ω, increment of contact resistance max. 40m Ω MIL-STD-1344A, METHOD 1002 Bath temperature 40 ±2°C, humidity 90 to 95% R.H. Saltwater spray resistance (Receptacle and plug mated) 24 hours, insulation resistance min. 100M Ω, increment of contact resistance max. 40m Ω MIL-STD-1344A, METHOD 1001 Bath temperature 35 ±2°C, saltwater concentration 5±1% H2S resistance (Receptacle and plug mated) 48 hours, increment of contact resistance max. 40m Ω JEIDA-38-1984 Bath temperature 40 ±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Insertion and removal life Mechanical life: 30 times, increment of contact resistance max. 40m Ω Min. 0.165 composite removal force × No. of pins + 0.33N Repeated insertion and removal speed of max. 200 times/hours Resistance to soldering heat Receptacle Initial electrical and mechanical characteristics must be maintained. Reflow soldering: Max. peak temperature of 260 °C, 2 cycles (PC board surface temperature of near connector terminals) Soldering iron: 350 °C within 3s, 300°C within 5s Plug Initial electrical and mechanical characteristics must be maintained. Connecting wires portion pulse heat: Max. peak temperature of 300 °C, 3s (Don’t touch the heater head to molded portion) Plug cover shell soldering portion: Soldering iron: 350 °C within 3s, 300°C within 5s Part name Material Color Surface treatment Molded portion LCP resin (UL 94V-0) Black — Contact Copper alloy — Contact portion: Ni plating on base, Au plating on surface (Min. 0.1 µm) Soldering portion: Ni plating on base, Au plating on surface (Except for front edge of terminal) Shell Copper alloy — Contact portion: Ni plating on base, Au plating on surface Soldering portion: Ni plating on base, Au plating on surface (Except for front edge of terminal) Part name Material Color Surface treatment Molded portion LCP resin (UL 94V-0) Black — Post Copper alloy — Contact portion: Ni plating on base, Au plating on surface (Min. 0.1 µm) Soldering wire portion: Ni plating on base, Au plating on surface Insert shell Copper alloy — Ni plating Part name Material Color Surface treatment Shell Copper alloy — Ni plating on base, Au plating on surface Order Temperature ( °C) Time (minutes) 1 2 3 4 –55 85 –55 0 −3 30 Max. 5 30 Max. 5 +3 0 0 −3 |
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