TFP401A-Q1

SLDS190 – NOVEMBER 2012

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ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply-voltage range

–0.3

4

V

Input-voltage range, logic and analog signals

–0.3

4

V

Operating ambient temperature range

-40

85

°C

Storage temperature range

–65

150

°C

4.3

Package power dissipation,

W

PowerPAD package

2.7

Human Body Model (HBM) AEC-Q100 Classification Level H2

2

kV

ESD rating

Charged Device Model (CDM) AEC-Q100 750 V Classification Level C3B

750

mA

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Specified with PowerPAD bond pad on the backside of the package soldered to a 2-oz. (0.071-mm thick) Cu plate PCB thermal plane.

Specified at maximum allowed operating temperature, 70°C.

(3)

PowerPAD bond pad on the backside of the package is not soldered to a thermal plane. Specified at maximum allowed operating

temperature, 70°C.

THERMAL INFORMATION

TFP401A-Q1

PZP

UNIT

100 PINS

Junction-to-ambient thermal resistance

26

°C/W

Junction-to-case (top) thermal resistance

12.3

°C/W

Junction-to-board thermal resistance

7.3

°C/W

Junction-to-top characterization parameter

0.3

°C/W

Junction-to-board characterization parameter

7.2

°C/W

Junction-to-case (bottom) thermal resistance

1.6

°C/W

spacer

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

3

3.3

3.6

V

(1)

Pixel time

6.06

40

ns

Single-ended analog-input termination resistance

45

50

55

Ω

Operating free-air temperature

0

25

70

°C

(1)

6

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