PS9711

RECOMMENDED SOLDERING CONDITIONS

(1) Infrared reflow soldering

•

Peak reflow temperature

235 ˚C or below (package surface temperature)

•

Time of temperature higher than 210 ˚C

30 seconds or less

•

Number of reflows

Three

•

Flux

Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt % is

recommended).

(2) Dip soldering

•

Temperature

260 ˚C or below (molten solder temperature)

•

Time

10 seconds or less

•

Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

•

Flux

Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt % is recommended).

(3) Cautions

• Fluxes

Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process.

Time (s)

100 to 160 ˚C

60 to 120 s

(preheating)

(heating)

to 10 s

to 30 s

235 ˚C (peak temperature)

210 ˚C

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected

to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify

CEL for all damages resulting from such improper use or sale.

A Business Partner of NEC Compound Semiconductor Devices, Ltd.

03/17/2003