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IC234-1284-043 Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers

Part # IC234-1284-043
Description  QFP (Quad Flat Packages, Gullwing Leads)
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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IC234-1284-043 Datasheet(HTML) 1 Page - List of Unclassifed Manufacturers

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SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
SMT Devices
46 Test Solutions
Specifications
Insulation Resistance:
1,000M
Ω min. at 100V DC
Dielectric Withstanding Voltage: for 1 minute (socket depended)
Contact Resistance:
30m
Ω max. at 10mA/20mV max.
Operating Temperature Range:
–40°C to +150°C (for type PEI/PSF)
–55°C to +170°C (for type PES)
–55°C to +170°C (for type PEI)
Mating Cycles:
10,000 insertions min.
Materials and Finish
Housing: Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass-filled
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Series Overview
*QFP (Quad Flat Packages, Gullwing Leads)
Series IC51 (Clamshell)
QFP, PQFP, TQFP and MQUAD®
Part Number (Details)
0.4mm to 1.27 Pitch
As specifications for this product differ by pitch
and material-mix, please contact our Sales Department
for detailed information.
Series No.
Number of Sides
with Contacts
No. of Contact Pins
Design Number
IC51
064
807
4
--
*QFP variations e.g. BQFP...
Specifications
Insulation Resistance:
1,000M
Ω min. at 500V DC, pitch 0.4 to 0.8
Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.5 to 0.8
Contact Resistance:
30m
Ω max. at 10mA/20mV max.
Operating Temperature Range:
–40°C to +150°C
Mating Cycles:
10,000 insertions min.
Contact Force:
20g to 45g per pin
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Series IC357 and IC402 (Open Top)
Quad Flat Package (QFP) with 2-Point Contact Type
0.4 to 0.8mm Pitch
--
Series No.
Number of Sides
with Contacts
No. of Contact Pins
Design Number
Positioning Pin
N=Without Positioning Pin
P=With Positioning Pin
IC357
100
002
4*
Part Number (Details)
Specifications
Insulation Resistance:
1,000M
Ω min. at 100V DC pitch 0.4, 0.5
1,000M
Ω min. at 500V DC pitch 0.65, 0.8
Dielectric Withstanding Voltage: 100V AC for 1 minute pitch 0.4, 0.5
500V AC for 1 minute pitch 0.65
700V AC for 1 minute pitch 0.8
Contact Resistance:
30m
Ω max. at 10mA/20mV max.
Operating Temperature Range:
–40°C to +150°C
Contact Force:
20g to 80g per pin
Mating Cycles:
10,000 insertions min.
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Series IC234 (Open Top)
Quad Flat Package (QFP) with Shoulder Contact Type
0.4 to 0.8mm Pitch
Part Number (Details)
Series No.
Number of Sides
with Contacts
No. of Contact Pins
Design Number
Positioning Pin
N= Without Positioning Pin
P= With Positioning Pin
K= Protection Key
IC234
120
017
4*
--
**
** Protection Key: Prevents IC from releasing during transportation


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