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30069-08C1 Datasheet(PDF) 2 Page - Molex Electronics Ltd.

Part # 30069-08C1
Description  Mini-Fit짰 TPA Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 8 Circuits, Tin (Sn) Plating, without Drain Holes
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Manufacturer  MOLEX11 [Molex Electronics Ltd.]
Direct Link  http://www.molex.com
Logo MOLEX11 - Molex Electronics Ltd.

30069-08C1 Datasheet(HTML) 2 Page - Molex Electronics Ltd.

  30069-08C1 Datasheet HTML 1Page - Molex Electronics Ltd. 30069-08C1 Datasheet HTML 2Page - Molex Electronics Ltd.  
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Polarized to Mating Part
Yes
Polarized to PCB
Yes
Shrouded
Partial
Stackable
No
Surface Mount Compatible (SMC)
No
Temperature Range - Operating
-40°C to +105°C
Termination Interface: Style
Through Hole
Electrical
Current - Maximum per Contact
13A
Voltage - Maximum
600V
Solder Process Data
Duration at Max. Process Temperature (seconds)
5
Lead-free Process Capability
Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
1
Process Temperature max. C
235
Material Info
Old Part Number
30069-08C1
Reference - Drawing Numbers
Packaging Specification
PK-30069-001
Product Specification
PS-5556-003
Sales Drawing
SDA-30069-****
This document was generated on 01/06/2014
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION


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