NID9N05ACLT4G datasheet(1/7 Pages) ONSEMI

Part #	NID9N05ACLT4G

Description	9.0 A, 52 V, N?묬hannel, Logic Level, Clamped MOSFET w/ESD Protection in a DPAK Package

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Manufacturer	ONSEMI [ON Semiconductor]

Direct Link	http://www.onsemi.com

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December, 2013 − Rev. 10

1

Publication Order Number:

NID9N05CL/D

NID9N05CL, NID9N05ACL

Power MOSFET

9.0 A, 52 V, N−Channel, Logic Level,

Clamped MOSFET w/ESD Protection

in a DPAK Package

Benefits

• High Energy Capability for Inductive Loads

• Low Switching Noise Generation

Features

• Diode Clamp Between Gate and Source

• ESD Protection − HBM 5000 V

• Active Over−Voltage Gate to Drain Clamp

• Scalable to Lower or Higher RDS(on)

• Internal Series Gate Resistance

• AEC−Q101 Qualified and PPAP Capable

• These Devices are Pb−Free and are RoHS Compliant

Applications

• Automotive and Industrial Markets:

Solenoid Drivers, Lamp Drivers, Small Motor Drivers

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating

Symbol

Value

Unit

Drain−to−Source Voltage Internally Clamped

VDSS

52−59

V

Gate−to−Source Voltage − Continuous

VGS

±15

V

Drain Current − Continuous @ TA = 25°C

Drain Current − Single Pulse (tp = 10 ms)

ID

IDM

9.0

35

A

Total Power Dissipation @ TA = 25°C

PD

1.74

W

Operating and Storage Temperature Range

TJ, Tstg −55 to 175

°C

Single Pulse Drain−to−Source Avalanche

Energy − Starting TJ = 125°C

(VDD = 50 V, ID(pk) = 1.5 A, VGS = 10 V,

RG = 25 W)

EAS

160

mJ

Thermal Resistance, Junction−to−Case

Junction−to−Ambient (Note 1)

Junction−to−Ambient (Note 2)

RqJC

RqJA

5.2

72

100

°C/W

Maximum Lead Temperature for Soldering

Purposes, 1/8″ from Case for 10 seconds

TL

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. When surface mounted to a FR4 board using 1″ pad size, (Cu area 1.127 in2).

2. When surface mounted to a FR4 board using minimum recommended pad

size, (Cu area 0.412 in2).

Device

Package

Shipping†

ORDERING INFORMATION

DPAK

CASE 369C

STYLE 2

MPWR

Drain

(Pins 2, 4)

Source

(Pin 3)

Gate

(Pin 1)

MARKING

DIAGRAM

Y

= Year

WW

= Work Week

xxxxx

= 05CL or 05ACL

G

= Pb−Free Package

RG

Overvoltage

Protection

ESD Protection

http://onsemi.com

1 = Gate

2 = Drain

3 = Source

4 = Drain

1

2

3

4

YWW

D9N

xxxxxG

VDSS

(Clamped)

RDS(ON) TYP

ID MAX

(Limited)

52 V

90 mW

9.0 A

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

NID9N05CLG

DPAK

(Pb−Free)

75 Units/Rail

NID9N05CLT4G

DPAK

(Pb−Free)

2500/Tape & Reel

NID9N05ACLT4G

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