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REV.0.0-AUG.4.2008

2N7002DW

MECHANICALDATA

• Case: SOT-363 Package

• Terminals : Solderable per MIL-STD-750,Method 2026

• Apporx. Weight: 0.0002 ounces , 0.006grams

• Marking : 702

60V N-Channel Enhancement Mode MOSFET

Maximum RATINGS and Thermal Characteristics (T

O

C unless otherwise noted )

Note: 1. Maximum DC current limited by the package

2. Surface mounted on FR4 board, t < 10 sec

PAN JIT RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE

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FEATURES

• R

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• Advanced Trench Process Technology

• High Density Cell Design For Ultra Low On-Resistance

• Specially Designed for Battery Operated Systems, Solid-State Relays

Drivers : Relays, Displays, Lamps, Solenoids, Memories, etc.

•

0.012(0.30)

0.005(0.15)

0.010(0.25)

Unit inch(mm)

：

SOT-363

0.054(1.35)

0.045(1.15)

0.087(2.20)

0.074(1.90)

0.030(0.75)

0.021(0.55)

0.056(1.40)

0.047(1.20)

0.010(0.25)

0.003(0.08)