© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

C1014_X7R_FE-CAP_SMD • 6/6/2014

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Floating Electrode Design (FE-CAP), X7R Dielectric, 6.3 – 50 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches)

L

B

W

S

T

EIA

Size

Code

Metric

Size

Code

L

Length

W

Width

T

Thickness

B

Bandwidth

S

Separation

Minimum

Mounting

Technique

0402

1005

1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)

See Table 2 for

Thickness

0.30 (.012) ± 0.10 (.004)

0.30 (.012)

Solder Reflow Only

0603

1608

1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006)

0.35 (.014) ± 0.15 (.006)

0.70 (.028)

Solder Wave or

Solder Reflow

0805

2012

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

0.50 (0.02) ± 0.25 (.010)

0.75 (.030)

1206

3216

3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)

0.50 (0.02) ± 0.25 (.010)

N/A

1210

3225

3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)

0.50 (0.02) ± 0.25 (.010)

Solder Reflow Only

1812

4532

4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)

0.60 (.024) ± 0.35 (.014)

Benefits

• -55°C to +125°C operating temperature range

• Floating Electrode/fail open design

• Low to mid capacitance flex mitigation

• Lead (Pb)-Free, RoHS and REACH compliant

• EIA 0402, 0603, 0805, 1206, 1210, and 1812 case sizes

• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,

200 V, and 250 V

• Capacitance offerings ranging from 150 pF to 0.22 μF

• Available capacitance tolerances of ±5%, ±10%, and ±20%

• Commercial and Automotive (AEC–Q200) grades available

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination finish allowing for

excellent solderability

• SnPb termination finish option available upon request (5%

minimum)

Applications

Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits without

(integrated) current limitation and any application that is subject to high levels of board flexure or temperature cycling. Examples

include raw power input side filtering (power plane/bus), high current applications (automobile battery line) and circuits that cannot be

fused to open. Markets include consumer, medical, industrial (power supply), automotive, aerospace and telecom.