CYStech Electronics Corp.

Spec. No. : C330SB

Issued Date : 2003.04.09

Revised Date :2011.01.28

Page No. : 6/6

SK32SB thru SK3BSB

CYStek Product Specification

SMB/DO-214AA Dimension

Marking Code :

SK32SB

SK33SB

SK34SB

SK32

SK33

SK34

SK36SB

SK3BSB

SK36

SK3B

SMB/DO-214AA Plastic

Surface Mounted Package

CYStek Package Code : SB

*:Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.075

0.083

1.91

2.11

E

0.006

0.012

0.152

0.305

B

0.130

0.155

3.30

3.94

F

0.002

0.008

0.051

0.203

C

0.160

0.185

4.06

4.70

G

0.030

0.060

0.76

1.52

D

0.083

0.096

2.13

2.44

H

0.200

0.220

5.08

5.59

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Lead : Pure tin plated.

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.