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S3AB Datasheet(PDF) 1 Page - Diodes Incorporated |
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S3AB Datasheet(HTML) 1 Page - Diodes Incorporated |
1 / 2 page DS16005 Rev. 8 - 2 1 of 2 S3A/B-S3M/B S3A/B - S3M/B 3.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER Features AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package A, B, D, G, J, K, M Designates SMC Package SMB SMC Dim Min Max Min Max A 3.30 3.94 5.59 6.22 B 4.06 4.57 6.60 7.11 C 1.96 2.21 2.75 3.18 D 0.15 0.31 0.15 0.31 E 5.00 5.59 7.75 8.13 G 0.10 0.20 0.10 0.20 H 0.76 1.52 0.76 1.52 J 2.00 2.62 2.00 2.62 All Dimensions in mm A B C D G H E J Maximum Ratings and Electrical Characteristics @ TA = 25°C unless otherwise specified · Glass Passivated Die Construction · Low Forward Voltage Drop and High Current Capability · Surge Overload Rating to 100A Peak · Ideally Suited for Automatic Assembly Mechanical Data · Case: Molded Plastic · Case Material - UL Flammability Rating Classification 94V-0 · Moisture sensitivity: Level 1 per J-STD-020A · Terminals: Solder Plated Terminal - Solderable per MIL-STD-202, Method 208 · Polarity: Cathode Band or Cathode Notch · Weight: SMB 0.093 grams (approx) SMC 0.21 grams (approx) · Marking: Type Number & Date Code, See Page 2 · Ordering Information: See Page 2 Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbo S3 A/AB S3 B/BB S3 D/DB S3 G/GB S3 J/JB S3 K/KB S3 M/MB Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 50 100 200 400 600 800 1000 V RMS Reverse Voltage VR(RMS) 30 70 140 280 420 560 700 V Average Rectified Output Current @TT = 75°C IO 3.0 A Non-Repetitive Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 100 A Forward Voltage @ IF = 3.0A VFM 1.15 V Peak Reverse Current @TA = 25°C at Rated DC Blocking Voltage @ TA = 125 °C IRM 10 250 µA Typical Total Capacitance (Note 1) CT 40 pF Typical Thermal Resistance Junction to Terminal (Note 2) RqJT 10 °C/W Operating and Storage Temperature Range Tj, TSTG -65 to +150 °C Notes: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC. 2. Thermal resistance: Junction to Terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink. |
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