CYStech Electronics Corp.

Spec. No. : C918E3

Issued Date : 2013.06.10

Revised Date :

Page No. : 8/8

MTE05N08E3

CYStek Product Specification

TO-220 Dimension

*: Typical

Millimeters

Inches

Millimeters

Inches

Marking:

CYS

E05N08

□□□□

1

2

3

Device Name

Date Code

Style: Pin 1.Gate 2.Drain 3.Source

4.Drain

3-Lead TO-220 Plastic Package

CYStek Package Code: E3

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

4.470

4.670

0.176

0.184

E1

12.060

12.460

0.475

0.491

A1

2.520

2.820

0.099

0.111

e

2.540*

0.100*

b

0.710

0.910

0.028

0.036

e1

4.980

5.180

0.196

0.204

b1

1.170

1.370

0.046

0.054

F

2.590

2.890

0.102

0.114

c

0.310

0.530

0.012

0.021

h

0.000

0.300

0.000

0.012

c1

1.170

1.370

0.046

0.054

L

13.400

13.800

0.528

0.543

D

10.010

10.310

0.394

L1

3.560

3.960

0.140

0.156

0.406

E

8.500

8.900

0.335

0.350

Φ

3.735

3.935

0.147

0.155

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.