DS30093 Rev. 9 - 2

1 of 3

BZT52C2V0S - BZT52C39S

www.diodes.com

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Planar Die Construction

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Ultra-Small Surface Mount Package

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Ideally suited for Automated Assembly

Processes

Features

Maximum Ratings

°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Forward Voltage (Note 2)

0.9

V

Power Dissipation (Note 1)

200

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

625

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Notes:

1. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com/datasheets/ap02001.pdf.

2. Short duration test pulse used in minimize self-heating effect.

Mechanical Data

BZT52C2V0S - BZT52C39S

SURFACE MOUNT ZENER DIODE

A

B

C

D

E

G

H

J

SOD-323

Dim

Min

Max

A

2.30

2.70

B

1.60

1.80

C

1.20

1.40

D

1.05 Typical

E

0.25

0.35

G

0.20

0.40

H

0.10

0.15

J

0.05 Typical

a

0

°

8

°

All Dimensions in mm

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Case: SOD-323, Plastic

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Case material - UL Flammability Rating

Classification 94V-0

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Moisture sensitivity: Level 1 per J-STD-020A

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Terminals: Solderable per MIL-STD-202,

Method 208

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Polarity: Cathode Band

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Marking: See Sheet 2

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Weight: 0.004 grams (approx.)