DS18001 Rev. 18 - 2

1 of 4

BZX84C2V4 - BZX84C39

www.diodes.com

BZX84C2V4 - BZX84C39

300mW SURFACE MOUNT ZENER DIODE

Features

·

Planar Die Construction

·

300mW Power Dissipation

·

Zener Voltages from 2.4V - 39V

·

Ideally Suited for Automated Assembly

Processes

Mechanical Data

A

E

J

L

TOP VIEW

M

B

C

H

G

D

K

Characteristic

Symbol

Value

Unit

Forward Voltage

0.9

V

Power Dissipation (Note 1)

300

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

417

°C/W

Operating and Storage Temperature Range

-65 to +150

°C

Notes:

1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at

http://www.diodes.com/datasheets/ap02001.pdf.

2. Short duration test pulse used to minimize self-heating effect.

3. f = 1KHz.

Maximum Ratings

°C unless otherwise specified

SOT-23

Dim

Min

Max

A

0.37

0.51

B

1.20

1.40

C

2.30

2.50

D

0.89

1.03

E

0.45

0.60

G

1.78

2.05

H

2.80

3.00

J

0.013

0.10

K

0.903

1.10

L

0.45

0.61

M

0.085

0.180

a

0

°

8

°

All Dimensions in mm

·

Case: SOT-23, Molded Plastic

·

Case material - UL Flammability Rating 94V-0

·

Moisture sensitivity: Level 1 per J-STD-020A

·

Terminals: Solderable per MIL-STD-202,

Method 208

·

Polarity: See Diagram

·

Marking: Marking Code & Date Code

(See Page 4)

·

Weight: 0.008 grams (approx.)