SAP5SD-B-G1-R datasheet(9/63 Pages) ETC2

Part #	SAP5SD-B-G1-R

Description	Universal Actuator-Sensor Interface IC

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SAP5S / SAP51

Universal Actuator-Sensor Interface IC

Data Sheet

July 17, 2012

the prior written consent of the copyright owner. The information furnished in this publication is PRELIMINARY and subject to

changes without notice.

9 of 62

1

General Device Specification

1.1. Absolute Maximum Ratings (Non Operating)

Table 1: Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Unit

Note

VLTGN

Voltage reference

0

V

VLTGP-LTGN

Voltage difference between LTGP and LTGN (VLTGP -

VLTGN)

0

40

V

1

VLTGP-LTGN_P Pulse voltage between LTGP and LTGN (VLTGP - VLTGN)

0

50

V

2

Vinputs1

Voltage at pin CDC, D0…D3, P0…P3, DSTBn, PSTBnBn,

LED1, LED2, PFAULT, UOUT

-0.3

V UOUT+ 0.3 V

Vinputs2

Voltage at pins OSC1, OSC2, U5R

-0.3

7

V

Iin

Input current into any pin except supply pins

-50

50

mA

4

H

Humidity non-condensing

5

VHBM

Electrostatic discharge – Human Body Model (HBM2)

1500

V

6

VEDM

Electrostatic discharge – Equipment Discharge Model

(EDM)

200

V

7



STG

Storage temperature

-55

125

°C



lead

Soldering temperature Sn/Pb

JEDEC-J-STD-020D

240

°C



lead

Soldering temperature 100%Sn

JEDEC-J-STD-020D

260

°C

Rthj-16

Thermal resistance of SOIC 16 package

80

100

K/W

8

Rthj-20

Thermal resistance of SOIC 20 package

75

95

K/W

8

1

reverse polarity protection has to be performed externally,

2

pulse with

 50µs, repetition rate  0.5 Hz

3

VLTGP-LTGN and VLTGP-LTGN_P must not be violated

4

Latch-up resistance, reference pin is 0V

5

Level 4 according to JEDEC-020D is guaranteed

6

HBM: C = 100pF charged to VHBM2 with resistor R = 1.5k in series, valid for all pins except LTGP-LTGN

7

EDM: C = 200pF charged to VEDM with no resistor in series, valid for LTGP-LTGN only

8

Single layer board, Ptot = 0.5W; air velocity = 0m/s  max. value; air velocity = 2.5m/s  min. value

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