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FBMJ2125HS420 Datasheet(PDF) 11 Page - Taiyo Yuden (U.S.A.), Inc |
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FBMJ2125HS420 Datasheet(HTML) 11 Page - Taiyo Yuden (U.S.A.), Inc |
11 / 15 page ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . chipbeads_reli_e-E02R01 CHIP BEAD INDUCTORS FOR POWER LINE (FB SERIES M TYPE) ■RELIABILITY DATA 1. Operating Temperature Range Specified Value -40℃~+125℃ Including self-generated heat 2. Storage Temperature Range Specified Value -40℃~+85℃ Test Methods and Remarks *Note: -5 to +40℃ in taped packaging 3. Impedance Specified Value Within the specified tolerance Test Methods and Remarks Measuring equipment : Impedance analyzer (HP4291A) or its equivalent Measuring frequency : 100±1 MHz 4. DC Resistance Specified Value Within the specified range Test Methods and Remarks Four-terminal method Measuring equipment : Milliohm High-Tester 3226 (Hioki Denki) or its equivalent 5. Rated Current Specified Value Within the specified range 6. Vibration Specified Value Appearance : No significant abnormality Impedance change : Within ±30% of the initial value Test Methods and Remarks According to JIS C 0040. Vibration type : A Time : 2 hrs each in X,Y, and Z directions Total: 6 hrs Frequency range : 10 to 55 to 10Hz (/min.) Amplitude : 1.5 mm (shall not exceed acceleration 196m/s2) Mounting method : Soldering onto PC board 7. Solderability Specified Value 90% or more of immersed surface of terminal electrode shall be covered with fresh solder. Test Methods and Remarks Solder temperature : 230±5℃ Immersion time : 4±1 sec. Preconditioning : Immersion into flux. Immersion and Removal speed : 25mm/sec. 8. Resistance to Soldering Heat Specified Value Appearance : No significant abnormality Impedance change : Within ±30% of the initial value Test Methods and Remarks Preheating : 150℃ for 3 min. Resistance to Soldering Heat : 260±5℃ Duration : 10±0.5 sec. Preconditioning : Immersion into flux. Immersion and Removal speed : 25mm/sec. Recovery : 2 to 3 hrs of recovery under the standard condition after the test. |
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