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OPA2677U-2K5 Datasheet(PDF) 2 Page - Texas Instruments |
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OPA2677U-2K5 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 38 page OPA2677 2 SBOS126I www.ti.com SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY OPA2677 SO-8 D –40 °C to +85°C OPA2677U OPA2677U Rails, 100 " " " " " OPA2677U/2K5 Tape and Reel, 2500 OPA2677 HSOP-8 DDA –40 °C to +85°C OP2677 OPA2677IDDA Rails, 75 " " " " " OPA2677IDDAR Tape and Reel, 2500 OPA2677 QFN-16 RGV –40 °C to +85°C OPA2677 OPA2677IRGVT Tape and Reel, 250 OPA2677IRGVR Tape and Reel, 2500 ABSOLUTE MAXIMUM RATINGS(1) Power Supply ............................................................................... ±6.5V DC Internal Power Dissipation .......................... See Thermal Characteristics Differential Input Voltage .................................................................. ±1.2V Input Common-Mode Voltage Range ................................................. ±V S Storage Temperature Range: U, DDA, RGV ................. –65 °C to +125°C Lead Temperature (soldering, 10s) .............................................. +300 °C Junction Temperature (TJ ) ........................................................... +150°C ESD Rating: Human Body Model (HBM)(2) ....................................................... 2000V Charge Device Model (CDM) ....................................................... 1000V Machine Model (MM) ..................................................................... 100V NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Pins 2 and 6 on SO-8 and HSOP-8 packages, and pins 2 and 11 on QFN-16 package > 500V HBM. PIN CONFIGURATIONS Top View ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. 1 2 3 4 12 11 10 9 NC –In B +In B NC 16 15 14 13 5 67 8 OPA2677RGV QFN-16 NC –In A +In A NC 1 2 3 4 8 7 6 5 +V S Out B –In B +In B OPA2677U, DDA SO-8, HSOP-8 Out A –In A +In A –V S NOTE: Exposed thermal pad on HSOP-8 and QFN-16 must be tied to –VS. |
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Similar Description - OPA2677U-2K5 |
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