©2009 Littelfuse, Inc.

Gas Discharge Tube (GDT) Products

16

Revised: November 30, 2009

Specifications are subject to change without notice.

Please refer to www.littelfuse.com for current information.

Customer should verify actual device performance in their specific applications.

CG5 and SL0902A Series

CG5 and SL0902A Series

Note: These devices are not recommended for IR

or Convection Reflow process.

Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (T

150°C

- Temperature Max (T

200°C

- Time (Min to Max) (t

60 – 180 secs

Average ramp up rate (Liquidus Temp

(T

3°C/second max

T

5°C/second max

Reflow

- Temperature (T

217°C

- Temperature (t

60 – 150 seconds

Peak Temperature (T

Time within 5°C of actual peak

Temperature (t

10 – 30 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Time

25

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

Soldering Parameters - Wave Soldering (Thru-Hole Devices)

Soldering Parameters - Hand Soldering

Dwell Time

0

20

40

60

80

100

120

140

160

180

200

220

240

260

280

300

Time (Seconds)

Cooling Time

Preheat Time

Wave Parameter

Lead-Free Recommendation

Preheat:

(Depends on Flux Activation Temperature)

(Typical Industry Recommendation)

Temperature Minimum:

100

Temperature Maximum:

150

Preheat Time:

60-180 seconds

Solder Pot Temperature:

280

Solder Dwell Time:

2-5 seconds

Recommended Process Parameters:

Solder Iron Temperature: 350° C +/- 5°C

Heating Time: 5 seconds max.