1

®

NIC COMPONENTS CORP. www.niccomp.com

www.lowESR.com

www.RFpassives.com

www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

Stacked Film Capacitor Chips

NSHC Series

FEATURES

• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM

• STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES

μF)

• HIGH HEAT AND MOISTURE RESISTANT

• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS

CHARACTERISTICS

• SUITABLE FOR REFLOW SOLDERING

• TAPE AND REEL PACKAGING

ENVIRONMENTAL CHARACTERISTICS

RECOMMENDED LAND

PATTERN (mm)

A

B

NSHC IS

RECOMMENDED

FOR NEW DESIGNS

SPECIFICATIONS

Case Sizes

0603

0805

1206

1210

1913

2416

Capacitance Range

100pF ~ 0.0027

μF 100pF ~ .01μF 3300pF ~ .047μF .012μF ~ .1μF .047μF ~ .1μF .12μF ~ .22μF

Voltage Ratings

16Vdc (12Vrms), 50Vdc (40Vrms)

Capacitance Tolerance

±5% Std, ±2% Opt.

Temperature Range

-55°C ~ +125°C (0.12

μF ~ 0.22μF voltage derated above +105°C)

Dissipation Factor (20°C)

0.6% max. @ 1KHz

Insulation Resistance (20°C)

3 Gigohms Minimum

Dielectric Withstanding Voltage

150% of Rated Voltage 60 Seconds or

175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes)

Temperature Characteristic

±3%

ΔC Maximum Over Temperature Range

Life Test At +125°C

1,000 Hours at 125% of

Rated Voltage

Capacitance Change

Within ±2% of Initial Value

Dissipation Factor

0.68% Maximum

Insulation Resistance

1 Gigohm Minimum

Resistance to Soldering Heat

+260°C Peak

Capacitance Change

Within ±3% of Initial Value

Dissipation Factor

0.66% Maximum

Insulation Resistance

1 Gigohm Minimum

Humidity Load Life:

(1) 1000 Hours, +40°C

(2) 500 Hours, +60°C

(3) 500 Hours +85°C/85% RH

Capacitance Change

(1) & (2) Within ±2% of Initial value (3) Within ±10% of initial value

Dissipation Factor

(1) & (2) 0.90% Maximum (3) 1.2% maximum

Insulation Resistance

(1) 1 Gigohm Minimum (2) 0.5 Gigohm Minimum (3) 0.01 Gigohm min.

Solderability with

25% Wt Rosin-Methanol Flux

90% Minimum Coverage After 2.5 Second Dip into 255°C Solder Pot

Case Code

EIA Size

A

B

C

J1

0603

0.6

2.0

0.7

A1, A2

0805

0.8

2.4

1.1

B1, B2, B3

1206

1.8

3.6

1.4

C2, C3

1210

1.8

3.6

2.3

D5, D6

1913

3.0

5.6

3.0

E6, E7, E8

2416

4.0

7.0

3.8

Solder within 1 year. Storage at +30°C and 60% RH

RECOMMENDED REFLOW PROFILE

(maximum 2 times)

Peak Temperature

260°C

50

100

150

200

250

300

Time

Pre-heat

150°C ~ 180°C

120 sec. max.

25

0

Cool Down

Time above 230°C

30 sec. max.

Ramp-up

25°C ~ 150°C

90 sec. max.

*See Part Number System for Details

RoHS

Compliant

includes all homogeneous materials